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Micron flaky silver grains and production method thereof

A manufacturing method and micron-level technology, applied in the direction of adhesive additives, electrical components, circuits, etc., can solve the problems of micron-level flaky silver particles in different specifications, energy consumption, time consumption, complexity, etc., to achieve economical and environmentally friendly processes, Improve complex effects

Inactive Publication Date: 2015-04-08
CHINA STEEL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] One aspect of the present invention is to provide a kind of manufacture method of micron flaky silver particle, it utilizes the concentrated nitric acid / silver nitrate of low weight ratio and the silver nitrate / reductive agent of high weight ratio, in the presence of surfactant, in liquid Phase reduction generates uniformly dispersed micron-sized flake silver particles with preset specifications, thereby improving the shortcomings of the existing process such as complexity, energy consumption, high environmental load, and different specifications of the obtained micron-sized flake silver particles

Method used

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  • Micron flaky silver grains and production method thereof
  • Micron flaky silver grains and production method thereof
  • Micron flaky silver grains and production method thereof

Examples

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Embodiment 1

[0030] In this embodiment, 10 g of silver nitrate was dissolved in 100 mL of pure water, and then 10 mL of 67 weight percent (wt%) concentrated nitric acid was added to form an acidic (pH<2) silver nitrate aqueous solution. Next, 3 g of polyethylene glycol (MW=20000) surfactant solution was added to the acidic silver nitrate solution, stirred properly to make it uniformly dispersed, and mixed solution (A) was prepared.

[0031] In addition, 10 g of ascorbic acid or its derivatives (such as its salts) was dissolved in 50 mL of deionized water to prepare a reducing agent solution (B).

[0032] Next, after adjusting the temperature of the above two solutions to 30° C. with a heating device, the reducing agent solution (B) was poured into the mixed solution (A) to react for about 10 minutes. Afterwards, remove the upper liquid to separate the micron-sized flaky silver particles. Then, use deionized water, ethanol or their mixed solutions to clean the micron-sized flake silver par...

Embodiment 2 to 8

[0034] With the preparation method of the micron-scale flaky silver particles of Example 1, the difference is that the types, usage amounts and liquid phase reduction reaction temperature of the ingredients are changed in Examples 2 to 8, and its formula and test results are shown in Table 1 and Figure 2 to Figure 8 shown.

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Abstract

The invention relates to micron flaky silver grains and a production method thereof; and nitric acid / silver nitrate with low weight ratio and silver nitrate / reductant with high weight ratio have reduction reaction in liquid phase under the action of surfactant to produce uniform and dispersed micron flaky silver grains with preset specifications. The obtained micron flaky silver grains can be added into conductive adhesive so as to form a back-side electrode of a solar cell base material.

Description

technical field [0001] The invention relates to a silver particle and a manufacturing method thereof, in particular to a micron-sized flaky silver particle and a manufacturing method thereof. Background technique [0002] Conductive adhesives are widely used in traditional thick films, solar cells, sensors, RFID antennas, and solid-state light-emitting materials. The material of conductive adhesive can be generally divided into silver glue, aluminum glue and silver aluminum glue. Generally speaking, silver glue is mostly used for the front electrode of solar cells (referred to as front silver), while aluminum glue and silver-aluminum glue are mostly used on the back of solar cells as the back electrode or the wire for connecting modules in series (referred to as back silver). As far as the conductive adhesive used for back silver is concerned, since back silver does not have as high requirements for conductive particle specifications as front silver, the existing technology...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B22F9/24C09J9/02C09J11/04H01L31/0224
Inventor 陈镱夫张瑞东
Owner CHINA STEEL