Heat dissipation device and heat dissipation method for aluminum substrate gong plate

A heat dissipation method and technology of aluminum substrate, applied in the direction of maintenance and safety accessories, milling machine equipment, electrical components, etc., can solve problems such as scrapping, clogging of gongs and knives, excessive burrs of aluminum substrate, etc., to ensure chip removal ability, low cost, Improve the effect of scrapping

Active Publication Date: 2015-09-02
SHENZHEN KINWONG ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

It aims to solve the problem in the prior art that the residual aluminum chips on the gong plate are attached to the gong knife due to high temperature, blocking the chip removal groove of the gong knife, resulting in excessive burrs on the aluminum substrate and scrapping the problem

Method used

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  • Heat dissipation device and heat dissipation method for aluminum substrate gong plate
  • Heat dissipation device and heat dissipation method for aluminum substrate gong plate

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Embodiment Construction

[0021] The present invention provides a heat dissipation device and heat dissipation method for an aluminum substrate gong plate. In order to make the purpose, technical solution and effect of the present invention more clear and definite, the present invention will be further described in detail below. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0022] see figure 1 , which is a schematic diagram of an embodiment of the heat dissipation device for the aluminum substrate gong board of the present invention. As shown in the figure, the heat dissipation device includes: a liquid storage tank 100 for storing cooling liquid, an automatic motor 200, a fan nozzle 300, a switch 400 and a conduit 500; The spray head 300 , the switch 400 and the automatic motor 200 are arranged on the conduit 500 .

[0023] read on figure 1 , when starting to work, the aluminum substrate 10 ...

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Abstract

The invention discloses a radiating device and a radiating method of an aluminum substrate end-mill. The radiating device comprises a liquid storing tank, an automatic motor, a fan-shaped spray head, a switch and a guide pipe, wherein the liquid storing tank is used for storing a cooling liquid, and is connected with the fan-shaped spray head through the guide pipe; the switch and the automatic motor are arranged on the guide pipe; and the fan-shaped spray head is used for spraying the cooling liquid onto the end-mill and an aluminum substrate and adjusting the spraying time and frequency of the cooling liquid through the automatic motor and the switch. The cooling liquid is sprayed onto the end-mill and an aluminum substrate surface at a certain frequency, so that high temperature and plate surface contact temperature caused by high-speed rotation of a main shaft are lowered, residual aluminum scraps are prevented from sticking to an end-mill scrap discharging groove, the scrap discharging capability of the end-mill scrap discharging groove is ensured, and discarding caused by high temperature is improved; and meanwhile, the radiating device of the aluminum substrate end-mill further has the advantages of simple structure, low cost and the like, and has a good market popularization prospect.

Description

technical field [0001] The invention relates to the technical field of aluminum substrate processing, in particular to a heat dissipation device and a heat dissipation method for an aluminum substrate gong. Background technique [0002] Aluminum substrates are commonly found in LED lighting products. There are two sides, the white side is for soldering the LED pins, and the other side shows the natural color of aluminum. Generally, the heat-conducting paste is applied and then contacted with the heat-conducting part. [0003] Due to the high hardness of aluminum, it is easy to generate heat when processing aluminum substrates. Aluminum shavings and other residues during processing adhere to the tool due to high temperature, blocking the chip removal groove of the tool, resulting in the scrapping of the aluminum substrate. [0004] Specifically, aluminum chips and other residues block the chip removal groove of the tool, which greatly reduces the chip removal rate of the to...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23Q11/10B23C3/00H05K3/00
Inventor 杨成君
Owner SHENZHEN KINWONG ELECTRONICS
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