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Method for manufacturing high thermal conductivity graphite film

A technology of high thermal conductivity graphite and manufacturing method, applied in the direction of chemical instruments and methods, inorganic chemistry, non-metallic elements, etc., can solve problems such as damage, surface material falling off, weak material strength, etc., and achieve enhanced bending resistance and high heat dissipation , the effect of good bending resistance

Inactive Publication Date: 2013-04-03
NINGBO JINSHAN NEW MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] However, the existing high thermal conductivity graphite film also has deficiencies. Although the high thermal conductivity graphite film has a certain folding resistance, the strength between the materials is weak and can be easily torn or damaged due to the displacement of the adhered parts. , or the surface material falls off, etc.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] The manufacturing method of the high thermal conductivity graphite film of this embodiment adopts polyimide film as a raw material, and goes through two processes of carbonization and graphitization to achieve the required high thermal conductivity graphite film. The process is as follows:

[0025] a. Select polyimide film as the raw material, cut the polyimide film and graphite paper into specified size, stack the polyimide film cut into specified size to a certain height, and place each layer of polyimide Graphite paper is sandwiched between the amine films, so that the polyimide film and graphite paper form a cross-stacked shape; the stacking height depends on the height of the carbonization furnace;

[0026] b. Put the polyimide film cross-laminated with graphite paper at intervals into a carbonization furnace for carbonization. During carbonization, fill the carbonization furnace with nitrogen gas to carbonize the polyimide film in a nitrogen environment. The tempe...

Embodiment 2

[0031] The manufacture method of the high thermal conductivity graphite film described in this embodiment adopts polyimide film as raw material, inserts graphite paper between each layer of polyimide film, and wherein polyimide film thickness is 125 microns; Graphite Paper thickness is 3 mm. During carbonization, fill the carbonization furnace with argon to carbonize the polyimide film in an argon environment. The carbonization temperature is 1400°C, and the carbonization time is controlled for 1 hour at 1400°C. The graphitization is carried out in a nitrogen environment, and the temperature is controlled at 3000°C. ℃, the graphitization time is controlled at 3 hours. The resulting high thermal conductivity graphite film has a thickness of about 0.075mm; thermal conductivity ≥ 1650W / mK in the plane direction: 5.5 W / mK in the vertical direction Density g / cm3: 2.0 。 It will not break after 10,000 times of bending.

Embodiment 3

[0033] The manufacture method of the high thermal conductivity graphite film described in this embodiment adopts polyimide film as raw material, inserts graphite paper between each layer of polyimide film, and wherein polyimide film thickness is 50 microns; Graphite Paper thickness is 1 mm. When carbonizing, fill the carbonization furnace with nitrogen to carbonize the polyimide film in a nitrogen environment. The carbonization temperature is 1200°C, and the carbonization time is controlled at 1200°C for 3 hours; the graphitization is carried out in an argon environment, and the temperature is controlled at 2800°C. , graphitization time is controlled at 5 hours. The high thermal conductivity graphite film thus obtained has a thickness of about 0.03mm; thermal conductivity ≥ 1600W / mK in the plane direction: 5.3 W / mK in the vertical direction Density g / cm3: 1.95 。 It will not break after 10,000 times of bending.

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Abstract

The invention discloses a method for manufacturing a high thermal conductivity graphite film, which adopts polyimide films as raw materials and is formed through two processes of carbonization and graphitization. The technological processes of the high thermal conductivity graphite film comprise the steps as follows: a, the polyimide films are selected as the raw materials, and a piece of graphite paper is clamped between each layer of the polyimide films; b, the polyimide films which are provided with the graphite paper at intervals, crossed and stacked are placed into a carbonization furnace to be carbonized in an environment of nitrogen or argon, the carbonized temperature ranges from 1000 DEG C to 1400 DEG C, and the time is controlled from 1 hour to 6 hours; and c, after the carbonization, the graphitization is performed also in the environment of nitrogen or argon, the temperature is controlled in a range from about 2500 DEG C to 3000 DEG C, and the time is controlled within 12 hours. The method for manufacturing the high thermal conductivity graphite film has a simple manufacturing process, the high heat dissipation capacity of the graphite film is guaranteed, the bending-resistant performance is enhanced, and a requirement for a thin and light electronic product of a consumer is met to a certain extent.

Description

technical field [0001] The invention relates to a production technology of a graphite film used for heat conduction and heat dissipation, in particular to a manufacturing method of a high heat conduction graphite film. Background technique [0002] With the development of electronic devices and products in the field of high integration and high computing, the power dissipation has doubled, and heat dissipation has become an urgent problem to be solved. [0003] At present, various heat dissipation materials have been widely used. Different types of heat dissipation materials have different properties. For example, metal materials have good thermal conductivity, especially some metal materials, such as copper, aluminum, silver, etc., have particularly good thermal conductivity. Radiators made of these metals, such as copper radiators and aluminum radiators, are widely used. Its relevant parameters are as follows [0004] Material Thermal conductivity W / mK Spec...

Claims

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Application Information

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IPC IPC(8): C01B31/04C01B32/205
Inventor 岑建军
Owner NINGBO JINSHAN NEW MATERIAL
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