Cleaning method after wet etching

Abstract

The invention discloses a cleaning method after wet etching to ensure that the surface of a silicon chip after wet etching meets the quality inspection requirements. The cleaning method comprises the following steps: performing the first wet method to remove residual silicon debris after completing the metal aluminum wet etching process; forming a photoresist on the wet-etched metal aluminum through a photolithography process; and performing photoresist baking. dry; perform a dry ashing of photoresist; and perform a second wet process to remove silicon shavings residue.

Description

Technical field [0001] The invention belongs to the field of semiconductor integrated circuit manufacturing technology, and relates to a method for cleaning metal aluminum after wet etching. Background technique [0002] With the continuous growth of integrated circuit integration, the feature size of integrated circuits continues to shrink, and the precision of integrated circuit production and processing is also increasing. The etching process that determines the final size of the device in the manufacturing process of integrated circuits becomes more and more important. Under the requirements of the continuous development of integrated circuits to small sizes, the dry etching process has good sidewall control capabilities, good feature size control capabilities, minimal photoresist shedding and adhesion problems, good uniformity and good The stability and controllability of the process has been widely used. However, because the wet etching process is isotropic chemical corro...

AI Technical Summary

Problems solved by technology

However, the ability of the wet process to remove silicon shavings is weaker than that of the dry process, and it cannot completely remove the silicon shavings, which will cause the problem of silicon shavings remaining

In the subsequent process, the residual silicon shavings will be scattered to various parts of the silicon wafer, forming black spots visible to the naked eye, which cannot meet the requirements of product online inspection and shipment inspection

If silicon shavings are left on metal interconnects or package pads, they can cause reliability issues and packaging issues

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