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Semiconductor storage device

A storage device and semiconductor technology, applied in semiconductor devices, information storage, semiconductor/solid-state device manufacturing, etc., can solve problems such as increased radiation noise, and achieve the effect of reducing the possibility of failure

Active Publication Date: 2013-04-03
SEMICON ENERGY LAB CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] However, when the memory cell array and peripheral circuits are arranged in layers, the possibility of radiated noise between the memory cell array and peripheral circuits increases.
As a result, the possibility of failure due to radiation noise increases when reading data in DRAM

Method used

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  • Semiconductor storage device
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Embodiment Construction

[0030] Next, one embodiment of the present invention will be described in detail. However, the present invention is not limited to the following description, and its forms can be changed into various forms without departing from the spirit and scope of the present invention. Therefore, the present invention should not be interpreted as being limited only to the description shown below.

[0031]

[0032] figure 1 It is a diagram showing a configuration example of a semiconductor memory device according to an embodiment of the present invention. figure 1 The shown semiconductor storage device includes: a peripheral circuit 100 including a semiconductor element formed using a semiconductor substrate 10; a shielding layer 20 disposed on the peripheral circuit 100 and formed of a conductive material; and disposed on the shielding layer 20 and comprising an oxide A memory cell array 30 of semiconductor elements made of material semiconductor materials. and, figure 1 The illust...

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Abstract

The invention provides a semiconductor storage device which can reduce probability of malfunction of the semiconductor storage device. A shielding layer is provided between a memory cell array (e.g., a memory cell array including a transistor formed using an oxide semiconductor material) and a peripheral circuit (e.g., a peripheral circuit including a transistor formed using a semiconductor substrate), which are stacked. With this structure, the memory cell array and the peripheral circuit can be shielded from radiation noise generated between the memory cell array and the peripheral circuit. Thus, probability of malfunction of the semiconductor storage device can be reduced.

Description

technical field [0001] The present invention relates to a semiconductor memory device. Background technique [0002] In recent years, metal oxides exhibiting semiconductor properties (hereinafter also referred to as oxide semiconductor materials) have attracted attention as materials for active layers of transistors. A transistor using an oxide semiconductor material as the material of the active layer can be manufactured by the same process as a transistor using amorphous silicon as the material of the active layer, and the mobility ratio of the transistor using the oxide semiconductor material as the material of the active layer is taken as the activity The material of the layer is higher than that of amorphous silicon transistors. Therefore, a transistor using an oxide semiconductor material as an active layer material is expected to replace or exceed a transistor using amorphous silicon as a material for an active layer. For example, a transistor to which an oxide semi...

Claims

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Application Information

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IPC IPC(8): H01L23/552H01L27/108G11C11/4063
CPCH01L27/0688H01L27/1225H01L21/76801H01L21/76826H10B12/03H10B12/30H10B12/05H10B41/70H10B12/48H10B12/50H10B20/00H01L27/1207H01L29/16H01L29/78H01L29/7869
Inventor 热海知昭奥田高
Owner SEMICON ENERGY LAB CO LTD