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Integrated electronic cooling module of diaphragm panel ceramic (DPC) substrate of light-emitting diode (LED) flip chip and manufacturing method of integrated electronic cooling module

An electronic refrigeration and flip-chip technology, which is applied in the direction of circuits, electrical components, semiconductor devices, etc., can solve the problems of device power and light extraction efficiency limitations, and achieve good heat dissipation effect and long service life.

Active Publication Date: 2013-04-03
NANJING ZHONGJIANG NEW MATERIAL TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the traditional sapphire substrate GAN high-power chip is mounted on the chip, and the electrodes are located on the light-emitting surface of the chip. This structure of the LED chip on the front has limitations in terms of device power and light-emitting efficiency.

Method used

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  • Integrated electronic cooling module of diaphragm panel ceramic (DPC) substrate of light-emitting diode (LED) flip chip and manufacturing method of integrated electronic cooling module
  • Integrated electronic cooling module of diaphragm panel ceramic (DPC) substrate of light-emitting diode (LED) flip chip and manufacturing method of integrated electronic cooling module
  • Integrated electronic cooling module of diaphragm panel ceramic (DPC) substrate of light-emitting diode (LED) flip chip and manufacturing method of integrated electronic cooling module

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] The manufacturing method of the LED flip-chip DPC ceramic substrate electronic refrigeration integrated module includes the following steps:

[0021] The first step is to make single-sided and double-sided substrates: on the ceramic electronic circuit substrate with high thermal conductivity and low thermal resistance, copper paste material is used, and the DPC process production technology is used to arrange the LED flip-chip series circuit and semiconductor thermopile parallel circuit. The electronic circuit diagram is made into a single-sided DPC high thermal conductivity and low thermal resistance ceramic electronic circuit substrate and a double-sided DPC high thermal conductivity and low thermal resistance ceramic electronic circuit substrate; the thermal conductivity of the high thermal conductivity and low thermal resistance alumina ceramic substrate is 24-31w / m 'k, with a density of 3.8-3.9g / cm 3 ;

[0022] The second step: use the assembly brazing process to ...

Embodiment 2

[0031] see figure 1 , figure 2 with image 3 , the LED flip-chip DPC ceramic substrate electronic refrigeration integrated module, including electronic refrigeration thermopile, that is, electronic refrigeration block 1; LED chip, that is, flip-chip LED chip 5, single-sided DPC ceramic electronic circuit substrate with high thermal conductivity and low thermal resistance 2. Double-sided DPC high thermal conductivity and low thermal resistance ceramic electronic circuit substrate 3 and sealant 4. This LED flip-chip DPC ceramic substrate electronic refrigeration integrated module is manufactured by the method in Embodiment 1, and will not be described in detail. This LED flip-chip DPC ceramic substrate electronic refrigeration integrated module adopts high thermal conductivity and low thermal resistance ceramic electronic circuit substrate, and uses electronic refrigeration thermopile to realize active refrigeration. After the LED flip-chip DPC ceramic substrate electronic c...

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Abstract

The invention discloses a manufacturing method of an integrated electronic cooling module of a DPC substrate of an LED flip chip. The method comprises the steps of manufacturing a single-side substrate and a double-side substrate, manufacturing the DPC aluminum oxide ceramic electronic cooling substrate, sealing and packaging the LED chip. The invention also discloses the integrated electronic cooling module of the DPC substrate of the LED flip chip. According to the method and the integrated electronic cooling module, a high-thermal-conductivity low-thermal-resistance ceramic electronic circuit substrate is used, and an electronic cooling thermopile is used, so that active cooling can be achieved; and after the integrated electronic cooling module is connected with a power supply, the integrated electronic cooling module can serve as an LED lamp, and the integrated electronic cooling module is good in heat dissipation effect and long in service life.

Description

technical field [0001] The invention relates to semiconductor light-emitting diode (LED) materials and devices and its manufacturing process, in particular to an LED flip-chip DPC ceramic substrate electronic refrigeration integrated module and its manufacturing method. Background technique [0002] LED lighting technology has the advantages of energy saving, long life, maintenance-free, easy control, and environmental protection. It is one of the most promising high-tech fields in the 21st century. It will replace incandescent lamps and fluorescent lamps and become the leader in the lighting market. The international LED lighting industry has maintained a growth rate of 40% in recent years. Faced with the huge business opportunities and encouraging development prospects of LED lighting, countries around the world have taken action one after another. Japan, the United States, the European Union, and South Korea have invested heavily in recent years to launch national LED lig...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/64H01L33/48
Inventor 李俊欧阳晖传丁萍吴迪谢胜和
Owner NANJING ZHONGJIANG NEW MATERIAL TECH