Integrated electronic cooling module of diaphragm panel ceramic (DPC) substrate of light-emitting diode (LED) flip chip and manufacturing method of integrated electronic cooling module
An electronic refrigeration and flip-chip technology, which is applied in the direction of circuits, electrical components, semiconductor devices, etc., can solve the problems of device power and light extraction efficiency limitations, and achieve good heat dissipation effect and long service life.
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Embodiment 1
[0020] The manufacturing method of the LED flip-chip DPC ceramic substrate electronic refrigeration integrated module includes the following steps:
[0021] The first step is to make single-sided and double-sided substrates: on the ceramic electronic circuit substrate with high thermal conductivity and low thermal resistance, copper paste material is used, and the DPC process production technology is used to arrange the LED flip-chip series circuit and semiconductor thermopile parallel circuit. The electronic circuit diagram is made into a single-sided DPC high thermal conductivity and low thermal resistance ceramic electronic circuit substrate and a double-sided DPC high thermal conductivity low thermal resistance ceramic electronic circuit substrate; the thermal conductivity of the high thermal conductivity and low thermal resistance ceramic electronic circuit substrate is 24-31w / m 'k, with a density of 3.8-3.9g / cm 3 ;
Embodiment 2
[0031] see figure 1 , figure 2 and image 3 , this LED flip-chip DPC ceramic substrate electronic refrigeration integrated module includes a thermopile for electronic refrigeration, that is, an electronic refrigeration block 1; an LED chip, that is, a flip-chip LED chip 5, and a single-sided DPC ceramic electronic circuit substrate with high thermal conductivity and low thermal resistance 2. Double-sided DPC high thermal conductivity and low thermal resistance ceramic electronic circuit substrate 3 and sealant 4. This LED flip-chip DPC ceramic substrate electronic refrigeration integrated module is manufactured by the method in Embodiment 1, and will not be described in detail. This LED flip-chip DPC ceramic substrate electronic refrigeration integrated module adopts high thermal conductivity and low thermal resistance ceramic electronic circuit substrate, and uses electronic refrigeration thermopile to realize active refrigeration. After the LED flip-chip DPC ceramic subs...
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