Package sandwich antenna for phase amplitude calibration

Abstract

The invention relates to a horn antenna, in particular to a package sandwich antenna for phase amplitude calibration. The antenna comprises a micro-strip feeder (1), a horn antenna (2) and plated-through holes (3) which are integrated on a dielectric substrate (4), the dielectric substrate (4) is disposed in an inner layer of a three-dimensional package (5), one end of the micro-strip feeder (1) is connected with an internal circuit (8) via a coplanar waveguide (7) on the side face of the package, the horn antenna (2) is composed of a bottom metal plane (9), a top metal plane (10) and plated-through hole side walls (11), a middle plated-through hole array (16), a left plated-through hole array (17) and a right plated-through hole array (18) which are composed of the plated-through holes (3) form four dielectric-filled waveguides in the horn antenna (2), and one ends of the four dielectric-filled waveguides face the micro-strip feeder (1) while the other ends of the four dielectric-filled waveguides are positioned on an antenna aperture surface (12). The antenna is capable of increasing antenna gain.

Description

technical field [0001] The invention relates to a horn antenna, in particular to a package sandwich antenna with phase amplitude calibration. Background technique [0002] Using stacked three-dimensional multi-chip (3D-MCM) technology, a radio frequency system can be integrated in a three-dimensional stacked package, for which it is also necessary to integrate the antenna on the package. Usually, the antenna is integrated on the surface of the package, for example, the patch antenna is integrated on the top of the package. But sometimes it is necessary to integrate the antenna in an interlayer in the middle of the package to meet the needs of the system. The above requirements can be achieved if the horn antenna is integrated in the interlayer inside the package. However, horn antennas are usually non-planar, incompatible with planar circuit technology, and have large geometric dimensions, which limits their application in packaging structures. In recent years, the substr...

AI Technical Summary

Problems solved by technology

However, the horn antenna is usually non-planar, incompatible with the planar circuit process, and has a large geometric size, which limits its application in the packaging structure

In recent years, the substrate-integrated waveguide horn antenna developed based on substrate-integrated waveguide technology has the characteristics of small size, light weight, and easy planar integration, but the gain of the traditional substrate-integrated waveguide horn antenna is relatively low. The continuous opening of the mouth causes the phase out of synchronization when the electromagnetic wave propagates to the horn's aperture surface, the phase distribution of the aperture electric field intensity is uneven, and the radiation directivity and gain decrease. In addition, the amplitude of the electromagnetic field on the aperture surface is also very uneven, with a large middle The two sides are small, which also affects the radiation performance of the antenna

At present, methods such as dielectric loading and dielectric prism have been used to correct the asynchronous phase of the horn's aperture surface, but these methods cannot improve the inconsistency between the horn antenna and the free space wave impedance on the aperture surface, nor can they improve the amplitude distribution of the electromagnetic field on the aperture surface. Uniformity,

[0003] Moreover, these phase alignment structures increase the overall structural size of the antenna, which is not suitable for integration into the interlayer inside the package

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