Plasma apparatus for the abating emissions of per-fluoro compounds and plasma vortex reactor for making the plasma apparatus

Abstract

This invention provides a novel plasma apparatus, for the abating emissions of perfluoro compounds, which consists of a vortex plasma reactor, a venturi scrubber, a scrubber liquid sump, a packed tower scrubber, and a foam breaker. The said vortex plasma reactor has a plasma torch installed at the center of one end, and tangentially injected ports installed at the other end for the intake of flue gas containing perfluoro compounds and an amount of water for chemical reaction, to generate a highly turbulent vortex flow with high temperature gradient for enhancing the chemical reaction and destruction of the said perfluoro compounds. The flue gas from the said vortex plasma reactor is further treated by the said venturi scrubber for quenching and removal of acid gases and particulates, the said packed tower scrubber for the removal of acid gases, and the said foam breaker for the removal of entrained droplets and foams. The destruction and removal efficiency, of the said plasma apparatus for the abating emissions of PFCs, has demonstrated to reach 99.9%.

Description

technical field [0001] The present invention is related to a plasma treatment device for perfluorinated waste gas in the semiconductor industry, in particular to a perfluorinated plasma treatment device and a vortex plasma reactor applied to the plasma treatment device, which utilizes perfluorinated The compound waste gas is injected tangentially into the vortex plasma reactor to form a strong vortex, so that the perfluorinated waste gas and appropriate amount of water react with the plasma torch at high temperature to completely destroy the perfluorinated compounds in the waste gas. Then use Venturi scrubber, wet scrubber and a foam remover to remove the acid gas and granular matter produced by the reaction, so as to achieve the goal of high destruction removal efficiency. Background technique [0002] Semiconductor processes make extensive use of CF 4 、C 2 f 6 、NF 3 Per-fluorocompounds (PFC for short) are used as process gases, but only a small part of these gases are ...

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Problems solved by technology

[0006] This traditional approach needs to utilize the reaction in the independent reaction chamber 113 after leaving the contact of the plasma torch 112. Therefore, the plasma torch 112 must provide enough energy to maintain a high temperature (for example, 1,000° C.), and the inside of the reaction chamber 113 It must be constructed of fire-resistant and heat-insulating materials. Under the heating of the plasma torch, a high-temperature environment is formed so that the independent reaction chamber 113 can maintain the ability to destroy perfluorinated waste gas.

Moreover, after the reaction is carried out in the high-temperature independent reactio

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