Semi-automatic polishing machine

A kind of grinding machine, semi-automatic technology, applied in the direction of grinding machine, abrasive belt grinder, grinding/polishing equipment, etc., can solve the problems of manual operation difficult to control, the thickness of the metal conductive sheet becomes smaller, and affect the function of the metal conductive sheet, etc., to improve The effect of production efficiency and yield

Active Publication Date: 2013-04-10
NINGDE AMPEREX TECH
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  • Abstract
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In order to bond tin between two metal conductive sheets at a temperature below 360 degrees, the best way is to erase the protective coating at the junction of the two metal conductive sheets. At present, erasing the protective coating of the metal conductive sheet is mainly It is processed by hand, that is, the surface of the metal conductive sheet is wiped by sandpaper, but since the thickness of the metal conductive sheet with a protective coating is only 0.1mm, and the thickness of the pro

Method used

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Embodiment Construction

[0044] See Figure 1 to Figure 4 , a semi-automatic grinding machine, including a bracket 1 and a table 2, and also includes a first workbench 3 for fixing a workpiece to be polished and a second workbench 4 for grinding on the table 2, above the first workbench 3 A compacting device 5 for compacting the workpiece to be polished is provided, and the second workbench 4 is provided with an upper grinding device 6 and a lower grinding device 7 which can move cyclically, and between the upper grinding device 6 and the lower grinding device 7 is provided Grinding the gap where the workpiece protrudes, the size of the gap can be adapted and adjusted according to the thickness of the workpiece to be polished and the grinding pressure.

[0045] The upper grinding device 6 includes a driving roller 61, a driven roller 62, an upper sandpaper 63 and a driving device 64. The upper sandpaper 63 is set as a belt type, and the upper sandpaper 63 is sleeved on the driving roller 61 and the dr...

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Abstract

The invention relates to a semi-automatic polishing machine, which comprises a bracket, a table board, a first workbench arranged on the table board and used for fixing a workpiece to be polished, and a second workbench used for polishing, wherein a pressing device used for pressing the workpiece to be polished is arranged above the first workbench, the second workbench is provided with an upper polishing device and a lower polishing device which can be moved circularly, and a gap for the workpiece to be polished to extend in is formed between the upper polishing device and the lower polishing device. The polishing times and the polishing strength can be precisely controlled by the semi-automatic polishing machine, so that the polishing thickness of a metal conducting plate can be controlled, automatic control is adopted by the semi-automatic polishing machine, and the production efficiency and the yield can be improved.

Description

technical field [0001] The invention relates to the technical field of grinding equipment, in particular to a semi-automatic grinding machine. Background technique [0002] At present, in the field of battery production, in the internal components of the battery, two metal conductive sheets with an electrical connection relationship need to be connected by welding. Metal conductive sheets shipped from hardware processing factories generally have a protective coating on the surface, and most of the protective coating is nickel. When two metal conductive sheets are welded by soldering, due to the existence of the protective coating, when the welding temperature is below 360 degrees, it is difficult for tin to adhere to the junction of the two metal conductive sheets. In order to bond tin between two metal conductive sheets at a temperature below 360 degrees, the best way is to erase the protective coating at the junction of the two metal conductive sheets. At present, erasing...

Claims

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Application Information

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IPC IPC(8): B24B21/10B24B21/20
Inventor 朱伟
Owner NINGDE AMPEREX TECH
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