Art utilizing common equipment and material to manufacture High Density Interconnect (HDI) laminated plate

Abstract

Provided is an art utilizing common equipment and material to manufacture a High Density Interconnect (HDI) laminated plate. The art utilizing common equipment and material to manufacture the HDI laminated plate includes steps: A, conducting reduction process on a copper foil of a double-faced copper-clad plate which is used for lamination; B, conducting machine drilling, copper electroless plating and electroplating process on the plate which is conducted the reduction process; C, adopting a method of graph transferring to make only a single-faced annular ring for a drill hole of the copper-clad plate which is electroplated; D, manufacturing a lateral ply; E, coating the lateral ply by utilizing prepreg low-temperature lamination with resin; F, peeling glass fibers; G, pressing the two kinds of material including the resin and the glass fibers together by aiming at a vacuum hot-pressing; H, eliminating the resin which is in a blind hole through concentrated sulfuric acid; I, conducting normal drilling, copper electroless plating, electroplating, graph transferring, solder resist and surface processes. The art utilizing common equipment and material to manufacture the HDI laminated plate adopts equipment of machine drilling, common copper electroless plating and electroplating and common materials such as prepreg and concentrated sulfuric acid and supplies an economical and practical method for a general circuit board factory to manufacture HDI lamination plate.

Description

Technical field: [0001] The invention belongs to the technical field of circuit board production, and specifically relates to a process method for making laminated boards using common equipment and materials. Background technique: [0002] HDI circuit boards are also called High Density Interconnectors. The realization of high-density interconnection is realized by reducing the line width, reducing the aperture and not occupying the wiring area of ​​other layers. The method of building up layers is the most important method to realize the space not occupying other layers. [0003] The build-up board is a circuit board (Build-up Muti-layer) that is interconnected between layers by a step-by-step stacking method. The communication holes between the layers of the laminate are impermeable to other layers, and high-density interconnection can be achieved because they do not occupy the wiring area of ​​other layers; while the ordinary blind hole process cannot simultaneously conn...

AI Technical Summary

Problems solved by technology

The communication holes between the layers of the laminated board do not penetrate other layers, and high-density interconnection can be realized because it does not occupy the wiring area of ​​other layers; while the ordinary blind hole process cannot connect adjacent layers at the same time

[0004] At present, the usual production method of HDI laminates is to use laser drilling and blind hole copper electroplating to realize the interconnection between layers, which requires the use of laser drilling machines, pulse electroplating and other equipment and RCC (resin copper foil) and other materials, equipment The materials and materials are very expensive, and the quality control of blind holes is very difficult; the depth and size of laser blind holes are limited by the power of laser drilling machine and the deep plating ability of blind hole plating, and it is difficult to achieve large aperture (greater than 0.15mm) and thick Blind holes with layer spacing (greater than 0.15mm)

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