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Surface mounting method for electronic components and printed circuit boards manufactured using said method

A technology for printed circuit boards and electronic components, which is applied in the direction of assembling printed circuits, printed circuits, printed circuits, etc. with electrical components, and can solve problems such as difficult NC drilling, multi-working hours and materials

Active Publication Date: 2015-06-24
NIPPON MEKTRON LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0031] However, in the manufacture of assembly-type multilayer printed wiring boards, in general, many man-hours and materials are required
In addition, it is necessary to form a bottomed via by laser processing that requires detailed condition setting, and it is difficult to form by NC drilling.

Method used

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  • Surface mounting method for electronic components and printed circuit boards manufactured using said method
  • Surface mounting method for electronic components and printed circuit boards manufactured using said method
  • Surface mounting method for electronic components and printed circuit boards manufactured using said method

Examples

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Embodiment Construction

[0053] Hereinafter, embodiments of the present invention will be described with reference to the drawings. In addition, the same reference numerals are used for structural elements having equivalent functions in each figure, and detailed description will not be repeated for structural elements with the same reference numerals.

[0054] First, combine figure 1 A method of manufacturing a multilayer flexible printed wiring board in which a mounting pad portion is provided directly above a through-via will be described.

[0055] (1) Prepare a flexible double-sided copper-clad laminate having copper foil 2A and copper foil 3A (each with a thickness of 12 μm, for example) on both sides of a flexible insulating base material 1A (for example, a 25 μm thick polyimide film) plate. And, if figure 1 As shown in (1), the copper foil 2A is processed into a predetermined circuit pattern using a photoprocessing method to manufacture a circuit base material 4A for assembly.

[0056] (2)...

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PUM

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Abstract

Disclosed is a surface mounting method for electronic components whereby electronic components are surface mounted to mounting pad sections provided directly above through vias, without adversely affecting productivity or reliability. Specifically disclosed is a method for surface-mounting an electronic component (60) to mounting pad sections (14) provided directly above through vias (11) in a printed wiring board (16). First, lid bodies (30) that cover through holes of the through vias (11) are mounted in the mounting pad sections (14). Then, soldered platforms that bury the lid bodies (30) are formed on the mounting pad sections (14) by solder printing. The electronic component (60) is then mounted on top of the printed wiring board (16) and the printed wiring board to which the electronic component (60) has been mounted is heat processed.

Description

technical field [0001] The present invention relates to a surface mounting method for electronic components, and more specifically, to a method for surface mounting electronic components on a mounting pad provided directly above a through-via (through-via) of a printed wiring board, and a method manufactured using the method. A printed circuit board. Background technique [0002] In recent years, miniaturization and high functionality of electronic equipment typified by mobile phones have been progressing. Along with this, there is also a demand for mounting smaller and highly functional electronic components on printed wiring boards. CSP (Chip Size Package: chip size package) is one of such electronic components. CSP is a package component that usually has solder balls for bonding at a narrow pitch of about 0.3 to 1.0mm, and is surface-mounted on a printed wiring board. [0003] In order to match the high density of the connection part of electronic components, the mount...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/34
CPCH05K1/113H05K3/3436H05K3/3485H05K2201/10234H05K2201/10674Y02P70/50
Inventor 河须崎聪松田文彦
Owner NIPPON MEKTRON LTD