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Light source device

A technology of a light source device and a light-emitting element, which is applied in the direction of light source, electric light source, lighting device, etc., can solve the problems affecting the luminous efficiency and life of the light source device 10, waste heat cannot be efficiently discharged, and the heat conduction effect of the insulating layer is poor, so as to achieve low Production cost, long service life, and good luminous efficiency

Inactive Publication Date: 2013-04-17
EVERLIGHT ELECTRONICS
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Problems solved by technology

Due to the extremely poor heat conduction effect of the insulating layer 5, the waste heat generated by the light emitting diode 2 cannot be efficiently discharged out of the light source device 10, thereby affecting the luminous efficiency and life of the light source device 10
In addition, in order to further improve the heat dissipation effect of the metal heat dissipation carrier plate 1 , expensive copper is often used as the material of the metal base, which also makes the cost of the known light source device 10 remain high.

Method used

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Embodiment Construction

[0060] figure 2 It is an exploded schematic diagram of a light source device according to an embodiment of the present invention. image 3 for figure 2 A three-dimensional schematic diagram of the assembled light source device. Please also refer to figure 2 and image 3 , the light source device 1000 of this embodiment includes a composite heat dissipation carrier 100 and at least one light emitting element 200 . The light emitting element 200 is disposed on the composite heat dissipation carrier 100 . The light emitting element 200 in this embodiment is, for example, a light emitting diode (LED), but the present invention is not limited thereto. In addition, the present invention does not limit the way in which the LEDs are electrically connected to the composite heat dissipation carrier 100 . For example, the light emitting diode is electrically connected to the composite heat sink carrier 100 by eutectic bonding or wire bonding technology. figure 2 and image 3 ...

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Abstract

The invention provides a light source device which comprises a composite radiating carrier plate and at least one lighting element. The composite radiating carrier plate comprises a metal substrate and an insulation substrate. The metal substrate is provided with at least one radiating protruding portion and at least one riveting portion. The insulation substrate is provided with a circuit layer electrically insulated with the metal substrate. The lighting element is electrically connected with the circuit layer through the insulation substrate. The radiating protruding portion of the metal substrate penetrates through the insulation substrate to be connected with the lighting element. The riveting portion of the metal substrate penetrates through the insulation substrate to be riveted with the insulation substrate.

Description

technical field [0001] The invention relates to a light source device, in particular to a light source device including a composite heat dissipation carrier plate. Background technique [0002] With the rising awareness of global environmental protection, energy-saving electronic products have become the current trend. Taking the lighting industry as an example, light-emitting diodes have become a new star in the lighting industry due to their advantages of energy saving, power saving, high efficiency, fast response time, long life and mercury-free. However, LEDs generate a lot of waste heat when they emit light. If the waste heat cannot be effectively discharged and accumulated in the LED, the luminous efficiency and lifespan of the LED will be reduced. [0003] The heat dissipation substrate carrying the LEDs plays an important role in heat dissipation. In the application of low-power light-emitting diodes, the heat-dissipating substrate is mostly made of a mixture of g...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F21S2/00F21V29/00F21V23/00F21Y101/02F21V29/70F21Y115/10
Inventor 许丰庭
Owner EVERLIGHT ELECTRONICS
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