Method for making circuit structure

Abstract

The invention discloses a method for making a circuit structure. The method comprises the following steps: a dielectric layer with a second surface is laminated on a first surface of a circuit substrate and a first patterned circuit layer; at least one blind hole and an engraved pattern are formed, and the blind hole extends from the second surface to the first patterned circuit layer; a patterned photoresist layer is formed on the second surface and provided with at least one opening, and the blind hole and the engraved pattern are exposed by the opening; a region where the patterned photoresist layer is positioned is defined as a first region, and a region outside the first region is defined as a second region; an activating layer is formed in the first region and the second region; the patterned photoresist layer and the activating layer in the first region are removed so as to leave the activating layer in the second region; an electricity conducting material is formed on the activating layer in the second region; and partial electricity conducting material and partial activating layer in the second region are removed.

Description

technical field [0001] The invention relates to a method for manufacturing a circuit structure, and in particular to a method for manufacturing a circuit structure with thin circuits. Background technique [0002] Generally speaking, the circuit structure of the circuit board is usually formed by photolithography and etching processes or laser ablation. Taking the existing manufacturing process of the buried circuit structure formed by laser ablation as an example, it includes the following steps. First, a dielectric layer is provided. Then, a laser beam is irradiated on the surface of the dielectric layer to form an intaglio pattern and a blind hole connected to the circuit layer. Then, a pre-treatment is performed to remove the smear or residue left after the laser (especially the surface of the circuit layer exposed at the bottom of the blind hole). Then, a palladium layer is formed on the surface of the dielectric layer and in the formed concave patterns and blind hol...

AI Technical Summary

Problems solved by technology

Therefore, the material cost and time cost of longer electroplating time to form a thicker conductive copper layer, the material cost and time cost of removing the conductive copper layer on the surface of the dielectric layer, and the excessive and unnecessary The production cost and time cost of the by-products and waste derived from the production conditions are a waste

Furthermore, the conductive copper layer increased by prolonging the electroplating time may also have uneven thickness distribution, which will not be conducive to the subsequent production of build-up circuit layers on it, let alone the production of stacked hole design or higher wiring. The problem of low production process yield of density circuit board and low reliability circuit structure

In addition, if photolithography and etching are used to form the circuit structure, it will face problems such as the use of a large amount of chemical liquid, which will cause environmental pollution and increase production costs.

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