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Rectangular aluminum electrolytic capacitor module with heat dissipation surface and structure of module

A technology for aluminum electrolytic capacitors and heat dissipation surfaces, which is applied in the direction of electrolytic capacitors, capacitors, capacitor parts, etc., and can solve problems such as poor high temperature characteristics, low capacity density ratio, and low reliability

Active Publication Date: 2013-04-24
周旺龙
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In order to make the capacitor into a rectangular box shape that is easy to install, some engineers try to use easy-to-implement film capacitors, such as the Japanese Toshiba Corporation JP2008148530A patent bulletin with a rectangular box-shaped film capacitor structure with heat dissipation, but film capacitors are compared with aluminum electrolytic capacitors. Low capacity density ratio and poor high-temperature characteristics of the product make the power conversion drive device bulky and unreliable

Method used

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  • Rectangular aluminum electrolytic capacitor module with heat dissipation surface and structure of module
  • Rectangular aluminum electrolytic capacitor module with heat dissipation surface and structure of module
  • Rectangular aluminum electrolytic capacitor module with heat dissipation surface and structure of module

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Embodiment Construction

[0027] Preferred embodiments of the present invention will be described below with reference to the accompanying drawings.

[0028] For the convenience of installing and connecting with the power MOSFET module 8 and the battery pack (such as figure 1 ), make the laminated busbar into a suitable shape, the positive busbar 1A and the negative busbar 1B are electrically insulated with the insulating layer 1C, and the two ends of the busbar are respectively provided with nut fixing columns 1E for connecting with the battery pack and with the power MOSFET module 8 Connecting terminal 1D (such as image 3 ).

[0029] The aluminum electrolytic capacitors 2 are arranged and distributed in the stacked bus bar 1. In order to reduce the structural volume and share the air guide slot 4, the electrolytic capacitor cylinder 2 is "lodged" on the fixed part 3 of the stacked bus bar 1 plane, that is, the aluminum electrolytic capacitor cylinder 2 is parallel to the plane axis of laminated bu...

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PUM

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Abstract

Disclosed is a rectangular aluminum electrolytic capacitor module with a heat dissipation surface and a structure of the module. A stack busbar is adopted as a skeleton structure, aluminum electrolytic capacitor cylinders are installed and distributed in parallel with the plane of the stack busbar in the axial direction, a closed air guide groove is used for releasing anti-explosion pressure of aluminum electrolytic capacitors out of the capacitor module, the stack busbar, the aluminum electrolytic capacitors and the air guide groove are sealed in an outer shell with thermal conductive pouring sealant, the pouring sealant plane of the outer shell is designed to be the heat dissipation surface, the heat dissipation surface is in close contact with an electric power conversion device radiator when the capacitor module is installed, and then a rectangular aluminum electrolytic capacitor parallel module product with a heat dissipation surface is realized.

Description

Technical field: [0001] The invention relates to a parallel combined module structure of an aluminum electrolytic capacitor for bus filtering and reactive power compensation in a power conversion device for driving an electric vehicle. Background technique: [0002] Low-voltage (battery voltage below 100VDC) low-power electric vehicles such as electric forklifts, electric golf carts, electric track vehicles, etc. drive power conversion devices such as choppers and inverters, the main circuit usually has many discrete MOSFETs components or low-voltage IGBT modules and many small aluminum electrolytic capacitors connected in parallel. This kind of dispersed parallel structure is complicated, and the assembly process is difficult. Especially after a large number of components are connected, the problem of voltage and current equalization is more prominent, and the problem of capacitor heat dissipation is not easy to solve, resulting in many problems such as low reliability and ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01G9/26H01G9/004H01G9/08
Inventor 周旺龙
Owner 周旺龙
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