Preparation method, grinding method and device for microsection sample

A technology of metallographic slicing and grinding device, which is applied in the preparation of test samples, etc., can solve the problems of inability to control the grinding position and depth, and achieve the effect of improving grinding efficiency
CN103076216AActive Publication Date: 2013-05-01GCI SCI & TECH
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
GCI SCI & TECH
Publication Date
2013-05-01

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Abstract

The invention discloses a preparation method for a microsection sample. The method comprises the following steps: providing a glue-pouring mould, wherein the glue-pouring mould comprises a step-shaped cavity, and the cavity consists a top part, a middle part and a bottom part, of which the diameters are sequentially reduced; providing a sample to be detected, wherein the sample to be detected comprises at least one circuit board slice connected in series through a positioning member, and a plurality of metalized holes in at least one circuit board slice are located in the same horizontal plane; placing the sample to be detected in the cavity of the glue-pouring mould through the positioning member and between the middle part and the bottom part of the cavity, and ensuring that a dividing line of the middle part and the bottom part is coincided with the center of the metalized holes; and pouring and filling pre-blended colloid into the cavity of the glue-pouring mould, and taking out the colloid after being completely cured to obtain the step-shaped microsection sample. The invention further discloses a grinding method and a device for a microsection.
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Description

technical field

[0001] The invention relates to the field of printed circuit board production, in particular to a method for preparing a metallographic section sample, a grinding method and a device. Background technique

[0002] Printed circuit board lamination and hole metallization are two key processes of circuit boards and the key to realizing reliable interconnection between circuit board layers. The quality of lamination and electroplating copper plating is closely related to the performance of the circuit board. Lamination conditions such as delamination and lamination voids exceeding the standard, and coating conditions such as plating voids and hole wall defects exceeding the standard may cause serious performance problems. cause the circuit board to fail. There are strict testing requirements in industry standards, and some products and customers also require testing reports and even testing samples.

[0003] In order to evaluate the quality of the lamination sy...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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