The invention provides a method for
polishing the back surface of an ultra-
small sample. The method comprises the following steps of sticking an ultra-small
chip on a first
gasket with the front surface facing downwards, splicing a splicing
gasket at the periphery of the
chip, cooling and fixing the
chip,
polishing the back surface of the chip, heating the first
gasket and taking down the chip andthe splicing gasket for later use, sticking the chip on a
glass slide with the front surface facing upwards, cooling and fixing, pricking needles on the front surface of the chip and obtaining hot spots on the back surface, heating the
glass slide with the chip, and taking down the chip, putting the chip on a second gasket coated with AB glue in a manner that the front surface of the chip faces upwards, tightly jointing and splicing a ground splicing gasket with the same height as the chip around the chip, then heating, fixing and cooling, removing a layer from the front surface of the sample, and determining a failure position around the hot spot. According to the method, the difficulty of
polishing the back surface of the ultra-
small sample can be greatly reduced, subsequent analysis can be carried out, meanwhile, a splicing gasket with a proper height is provided for subsequent
wafer grinding, and the
wafer grinding difficulty is reduced. The success rate of
sample preparation is greatly improved, the improvement of an online process is assisted and promoted, and the product yield is further improved.