Method for decreasing series resistors of P type substrate hetero junction with intrinsic thin layer (HIT) solar cell
A technology for solar cells and substrates, applied in circuits, photovoltaic power generation, electrical components, etc., can solve problems such as reducing battery open circuit voltage and increasing series resistance
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[0019] P-type substrate HIT battery:
[0020] Such as figure 1 As shown, an embodiment of the present invention uses a P-type silicon wafer to make a P-type substrate HIT cell. Compared with the existing P-type substrate HIT battery, the main difference is that the outside of the p-a-si:H layer (the side opposite to the middle P-type substrate 101) is sequentially covered with a high work function TCO layer 102 and a low work function TCO layer 103 .
[0021] figure 1 An exemplary fabrication method for the shown P-type substrate HIT cell is described in figure 2 middle. Firstly, the p-type silicon wafer is strictly cleaned and textured (201), and then the PECVD method is used to deposit and grow i-a-si:H of about 1-10nm and n-a-si:H of about 1-10nm (202 and 203 ); then turn over the silicon wafer ( 204 ), on the other side of the silicon wafer, still use PECVD method to deposit and grow 1-10nm i-a-si:H and 10-20nm p-a-si:H ( 205 and 206 ). Then use the reactive plasma ...
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