Cooling module

Abstract

The invention provides a heat dissipation module which comprises a supporting structure and a heat pipe. The supporting structure is adjacent to an electronic element. The heat pipe is connected to the supporting structure in a welding mode, and the bottom surface of the heat pipe directly contacts the top surface of the electronic element. Because the heat pipe directly contacts the electronic element, heat energy generated by the electronic element can be taken away from a heat source through a more efficient mode, and the character that the heat pipe directly contacts the electronic element can effectively reduces the whole thickness of the heat dissipation module.

Description

technical field [0001] The invention relates to a heat dissipation module, in particular to a heat dissipation module in which a heat pipe directly contacts an electronic component. Background technique [0002] In order to enable the portable electronic device to quickly process various signals, electronic components such as a central processing unit (CPU) or a graphic processing unit (GPU) are usually equipped therein. When a CPU or GPU is running at high speed in a computer, its own temperature will increase. Therefore, it is necessary to further equip a heat dissipation module so that electronic components such as CPU or GPU can operate in the normal operating temperature range to ensure the quality of signal processing, storage or transmission. [0003] A known heat dissipation module includes a heat spreader, a heat pipe and a heat dissipation fin. The heat spreader generally has an area larger than that of the electronic components, is disposed above the electronic ...

AI Technical Summary

Problems solved by technology

[0004] However, due to structural limitations, heat pipes cannot directly receive heat from electronic components, which will cause the heat dissipation efficiency of traditional heat dissipation modules to always fail to meet the heat dissipation requirements required by modern electronic components

On the other hand, due to the setting of the heat spreader, the thickness of the traditional heat dissipation module is increased, which hinders the development of modern electronic devices towards thinner and lighter.

Images