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grid array lga package module

A technology of LGA packaging and grid array, which is applied in the field of communication, can solve the problems of limiting the thickness of the whole machine and large area, and achieve the effects of reducing thickness, reducing the area of ​​the whole machine, and good mechanical and heat dissipation characteristics

Inactive Publication Date: 2017-09-22
ZTE CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Behind the obvious advantages of traditional LGA, we can also see its shortcomings: single-sided layout, the devices are concentrated on one side of the motherboard, occupying a larger area than double-sided layout, individual high devices on the board will limit the overall machine thickness

Method used

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Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0026] The technical scheme of the present invention uses a part of the geothermal pad area on the bottom surface of the LGA module to lay out some devices and cover them with a shield to effectively reduce the area of ​​the whole machine. The thickness of the top surface; all the components can also be moved to the bottom, so that the height of adaptation to the motherboard will be further reduced.

[0027] When adapting to the main board, holes can be opened on the main board corresponding to the area of ​​the shielding cover on the bottom surface of the LGA module, and the opening area corresponds to the shielding cover on the bottom surface.

[0028] The height of the top surface of the motherboard can be controlled very small due to the transfer of the high components of the LGA module. There are high components on the bottom of the LGA module, but there are holes in the corresponding positions of the motherboard, and the exposed part of the LGA module on the bottom of the...

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Abstract

The grid array LGA package module includes a printed circuit board. The printed circuit board includes a top surface and a bottom surface. There are relatively short components on the top surface, which are shielded by a set of independent top surface shielding covers; individual tall components are laid out on the bottom surface, and Shielded with a set of bottom side shields; the bottom side has a bottom pad. The technical solution invented is optimized on the basis of the traditional LGA packaging form. Through the flexible layout, it retains the characteristics of rich, stable and reliable interfaces of the LGA package module, reduces the thickness of the LGA package module to a certain extent, and adapts to the customer's motherboard. It has an advantage in height during the matching process, and can also reduce the area of ​​the LGA package module.

Description

technical field [0001] The present invention relates to the technical field of communication, and more specifically, to a grid array LGA packaging module. Background technique [0002] With the rapid development of 3G wireless communication technology and the continuous growth of the networking industry, industry users' demand for 3G functions is also increasing. [0003] The LGA (grid array) package module came into being in response to the strong demand of industry users. Compared with B2B, mini-PCIE and other package forms, it has already achieved a lot of advantages due to its rich interfaces, good mechanical stability and good heat dissipation characteristics. Become the new darling of the Internet of Things era. The LGA module can meet the needs of industries such as vehicle-mounted and handheld terminals for stable interfaces and light weight. [0004] Please refer to Figure 1 to Figure 3 As shown, the traditional LGA package adopts the device on the top surface, a...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/488
CPCH01L2224/16225
Inventor 何祥宇张淑慧韩正渭
Owner ZTE CORP