Technology method of void-free butt welding of large-area flat plate

A process method and no-void technology, applied in manufacturing tools, welding equipment, metal processing equipment, etc., can solve the problems of uneven solder filling, residual pores in welds, inconsistent heat dissipation and shielding performance, etc., and achieve the effect of reducing hole defects.

Inactive Publication Date: 2013-06-26
ZHANGJIAGANG DONGDA IND TECH RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, due to reflow soldering, the volatiles in the flux often cannot overflow in time, which will cause defects such as residual pores in the weld, resulting in uneven solder filling, inconsistent heat dissipation and shielding performance at different positions, and product quality cannot meet the requirements.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0016] The following is a further detailed description of a large-area flat plate gap-free butt welding process according to the present invention through specific examples.

[0017] First, print step by step, first print the low-melting point solder paste with a melting point of 191 degrees Celsius on the central area accounting for 80% of the end surface to be soldered, and then print the solder paste with a melting point of 223 degrees Celsius on the remaining 20% ​​of the surrounding area. The printed solder paste is matrix discontinuous Arrangement, the diameter of the solder joints is 0.3mm, and the distance between the solder joints is 1mm; fix the components to be soldered with printed solder paste with a fixture, so that the components to be soldered are completely fixed in the direction of the plane to be soldered, but have a certain degree of freedom in the vertical direction ; For reflow soldering, use a three-stage heating curve. The preheating temperature zone in ...

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PUM

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Abstract

The invention relates to a technology method of void-free butt welding of a large-area flat plate. The technology method of the void-free butt welding of the large-area flat plate comprises the following steps: a, adopting a substep printing technology, namely firstly printing low-melting-point soldering paste on the central area of a to-be-welded end face, and then printing high-melting-point soldering paste on the peripheral area of the to-be-welded end face; b, using a fixture to fix a to-be-welded device which is provided with soldering paste in a printing mode; and c, adopting a three-section type heating method to carry out reflow soldering. The technology method of the void-free butt welding of the large-area flat plate can improve quality of large-area butt welding of electronic devices.

Description

technical field [0001] The invention relates to the fields of electronic device welding and surface packaging materials, in particular to a process method for butt welding of large-area flat plates without gaps. Background technique [0002] With the development of electronic products, more and more electronic devices require the performance of heat dissipation, signal shielding, or signal transmission and reception. Most of these electronic devices require butt welding of large-area pads (or welding surfaces). At present, prefabricated solder sheets are usually used, or solder paste is printed with rectangular openings, and then reflowed to achieve butt soldering. However, during reflow soldering, the volatiles in the flux often cannot overflow in time, which will cause defects such as residual pores in the weld, resulting in uneven solder filling, inconsistent heat dissipation and shielding performance at different positions, and product quality cannot meet the requirement...

Claims

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Application Information

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IPC IPC(8): B23K1/00B23K1/20
Inventor 魏子陵陈旭周健
Owner ZHANGJIAGANG DONGDA IND TECH RES INST
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