Uncapping method for soft and hard combined plate and operating system thereof

A soft-rigid combination board and operating system technology, used in laser welding equipment, electrical components, printed circuit manufacturing, etc., can solve problems such as unevenness and difficult to control lasers, and achieve the effect of good uniformity and easy processing depth.

Inactive Publication Date: 2013-06-26
HANS LASER TECH IND GRP CO LTD +1
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The glass fiber in the FR-4 board is an interwoven structure. Since the interweaving structure of the glass fiber determines the inhomogeneity of the FR-4 board material itself, it is more difficult to cut the super...

Method used

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  • Uncapping method for soft and hard combined plate and operating system thereof
  • Uncapping method for soft and hard combined plate and operating system thereof
  • Uncapping method for soft and hard combined plate and operating system thereof

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Embodiment Construction

[0032] In order to express the purpose, technical solutions and advantages of the present invention more clearly, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0033] In order to improve the uniformity of the material of the opening part, a layer of single-sided copper foil 2 is pre-laminated on the flex-hard bonded board under the FR-4 board 1 where the cover needs to be opened (near the side of the soft board 3), such as figure 1 shown.

[0034] Aiming at the above-mentioned rigid-flex board and the effect of avoiding damage to the soft board during the opening process, the method for opening the rigid-flex board in a preferred embodiment of the present invention is as follows: figure 2 As shown, the method includes the following steps:

[...

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Abstract

The invention provides an uncapping method for a soft and hard combined plate. The uncapping method comprises the operating steps of: laminating a layer of single-side copper foil at one side of a FR-4 plate which is near a soft plate and is located at the place where uncapping is necessary in advance; carrying out a laser cutting test on a single un-laminated FR-4 plate and the single-side copper foil respectively so as to obtain a first laser parameter and a second parameter for just cutting off; fixing the soft and hard combined plate on a workbench of a laser cutting machine; carrying out program processing to convert the processing program needed by uncapping into a program format identifiable by software of the laser machine and inputting the program to an operating system; adjusting a focal distance to reach to the surface of the FR-4 plate, and cutting the FR-4 plate based on the tested first laser parameter; and adjusting the focal distance to reach to the surface of the single-side copper foil, and cutting the single-side copper foil based on the tested second laser parameter. Meanwhile, the invention also provides the operating system corresponding to the method. The uncapping method for the soft and hard combined plate avoids damaging the soft plate part during the uncapping process to the maximum extent as the characteristics that the copper foil has good uniformity, and the processing depth is relatively easy to control when the copper foil is cut off are utilized.

Description

【Technical field】 [0001] The invention relates to a method for uncapping a rigid-flex board by using a laser in the PCB field and an operating system thereof. 【Background technique】 [0002] Rigid-flex board is a new type of printed circuit board with both the durability of rigid PCB and the adaptability of flexible PCB. The advantages of rigid-flex board compared with hard board and soft board: [0003] 1. It has flexibility, can be wired three-dimensionally, and can change shape according to space constraints; [0004] 2. High and low temperature resistance, flame resistance; [0005] 3. It can be folded without affecting the signal transmission function; [0006] 4. The chemical change is stable, stable and reliable; [0007] 5. Reduce the size of the application product, greatly reduce the weight, and increase the function. [0008] Opening the cover is an important process in the production process of the rigid-flex board. Its purpose is to cut off the upper and low...

Claims

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Application Information

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IPC IPC(8): H05K3/00B23K26/38
Inventor 高子丰吕洪杰李强翟学涛高云峰
Owner HANS LASER TECH IND GRP CO LTD
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