Uncapping method for soft and hard combined plate and operating system thereof

Abstract

The invention provides an uncapping method for a soft and hard combined plate. The uncapping method comprises the operating steps of: laminating a layer of single-side copper foil at one side of a FR-4 plate which is near a soft plate and is located at the place where uncapping is necessary in advance; carrying out a laser cutting test on a single un-laminated FR-4 plate and the single-side copper foil respectively so as to obtain a first laser parameter and a second parameter for just cutting off; fixing the soft and hard combined plate on a workbench of a laser cutting machine; carrying out program processing to convert the processing program needed by uncapping into a program format identifiable by software of the laser machine and inputting the program to an operating system; adjusting a focal distance to reach to the surface of the FR-4 plate, and cutting the FR-4 plate based on the tested first laser parameter; and adjusting the focal distance to reach to the surface of the single-side copper foil, and cutting the single-side copper foil based on the tested second laser parameter. Meanwhile, the invention also provides the operating system corresponding to the method. The uncapping method for the soft and hard combined plate avoids damaging the soft plate part during the uncapping process to the maximum extent as the characteristics that the copper foil has good uniformity, and the processing depth is relatively easy to control when the copper foil is cut off are utilized.

Description

【Technical field】 [0001] The invention relates to a method for uncapping a rigid-flex board by using a laser in the PCB field and an operating system thereof. 【Background technique】 [0002] Rigid-flex board is a new type of printed circuit board with both the durability of rigid PCB and the adaptability of flexible PCB. The advantages of rigid-flex board compared with hard board and soft board: [0003] 1. It has flexibility, can be wired three-dimensionally, and can change shape according to space constraints; [0004] 2. High and low temperature resistance, flame resistance; [0005] 3. It can be folded without affecting the signal transmission function; [0006] 4. The chemical change is stable, stable and reliable; [0007] 5. Reduce the size of the application product, greatly reduce the weight, and increase the function. [0008] Opening the cover is an important process in the production process of the rigid-flex board. Its purpose is to cut off the upper and low...

AI Technical Summary

Problems solved by technology

The glass fiber in the FR-4 board is an interwoven structure. Since the interweaving structure of the glass fiber determines the inhomogeneity of the FR-4 board material itself, it is more difficult to cut the superimposed position of the glass fiber during laser cutting. , and the thinner gap next to it will be easier to cut, so it is difficult to control the laser to cut the hard board without damaging the soft board in the middle

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