Ultra-thin dot matrix display device and production method thereof

Abstract

The invention discloses an ultra-thin dot matrix display device and a production method thereof. The ultra-thin dot matrix display device comprises a PCB (Printed Circuit Board), an SMD (Surface Mount Device) LED (Light Emitting Diode) and a display cover shell, wherein the surface of the display cover shell is provided with uniform light pieces; the SMD LED is pasted on the PCB; and the display cover shell is fixedly connected with the PCB. The production method of the ultra-thin dot matrix display device comprises performing wiring on a control circuit and a dot matrix display LED circuit which are arranged on the PCB; pasting the SMD LED at a corresponding position on the PCB; buckling the display cover shell at a corresponding position on the PCB; and performing fixation and connection. According to the ultra-thin dot matrix display device and the production method of the ultra-thin dot matrix display device, the thickness of the ultra-thin dot matrix display device can be reduced to below 3mm; the production process is simple; the working efficiency is high; the production costs are low; the quality of products is stable and reliable; and particularly all components which are arranged on the PCB are capable of achieving single sided pasting without the need for insulation protection processing and capable of being directly pasted on a base board of a call box for usage.

Description

technical field [0001] The invention relates to an ultra-thin dot-matrix display and a manufacturing method thereof, and belongs to the technical field of ultra-thin call boxes for elevator landings. Background technique [0002] The bottomless call boxes at landings in the existing elevator market are gradually replacing the mainstream bottomed call boxes in the existing market because of their unique advantages of bottomless boxes. However, the thickness of such products is currently limited by the size and thickness of various internal devices and cannot be made thin enough, so they are relatively thick and cannot completely replace products with bottom boxes in terms of aesthetics. Tracing it to its cause, why the existing bottomless call box is still relatively thick, one of the devices that mainly limits the thickness is exactly the dot matrix display. [0003] The existing dot-matrix display is composed of a PCB circuit board and a dot-matrix display module. The dot-...

AI Technical Summary

Problems solved by technology

However, at present, the thickness of such products cannot be made thin enough due to the limitation of the size and thickness of various internal devices, so they are relatively thick and cannot completely replace products with bottom boxes in terms of aesthetics.

The reason is that the existing bottomless call boxes are relatively thick, and one of the main thickness-limiting devices is the dot matrix display

[0003] The existing dot-matrix display is composed of a PCB circuit board and a dot-matrix display module. The dot-matrix display module is purchased and has a thickness of 8-9mm. For the ladder box, it is still too thick

Moreover, this type of module usually uses in-line pins, which require lead-out solder joints on the back of the circuit board, and the solder joints will increase the thickness by 1mm. Moreover, if in-line pins are used, it is also necessary to make contact with the bottom plate of the call box. Insulation protection treatment; if patch pins are used, it will be necessary to increase the size of the module and the size of the circuit board; and the ability of this type of module to withstand temperature during soldering is weaker than other general components, and cannot withstand the high temperature of reflow soldering. Even if the wave soldering time is too long, it is easy to be damaged, so manual soldering is required, but manual soldering will not only increase the working hours and increase the manufacturing cost, but also have problems such as low efficiency and unstable product performance

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