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A method for inner hole polishing of metal parts formed by selective laser melting

A metal parts, laser melting technology, applied in the field of laser processing, can solve the problems of vibrating rod clamping, difficult positioning, prolonging the processing time of parts, and only one hole can be polished at a time, so as to shorten the polishing cycle and shorten the Manufacturing time and cost, effect of reducing polishing cost

Active Publication Date: 2015-07-29
WENZHOU UNIVERSITY
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, during ultrasonic polishing, for inner holes of different sizes and shapes, it is necessary to use machining methods to make polishing tools separately, which is time-consuming, laborious, and costly, prolonging the processing time of parts and limiting its large-scale industrial application; at the same time The vibrating rod needs to be assembled with the general-purpose ultrasonic transducer components and inserted into the inner hole of the metal part accurately. For metal parts with a large number of inner holes, the vibrating rod mounting plate must be made by machining alone or once Only one hole can be polished and polished in turn, so it is difficult to achieve accurate clamping and positioning of the vibrating rod, and the polishing efficiency is very low

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  • A method for inner hole polishing of metal parts formed by selective laser melting
  • A method for inner hole polishing of metal parts formed by selective laser melting

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Embodiment Construction

[0022] The present invention will be described in further detail below in conjunction with the accompanying drawings and specific embodiments.

[0023] The invention provides a method for polishing inner holes of metal parts formed by selective laser melting, such as figure 1 , 2 shown, including the following steps:

[0024] (1) According to the CAD model of the metal part 1, design the ultrasonic vibrating rod 2 adapted to the inner hole on the metal part 1; the design method is the same as that of the existing ultrasonic vibrating rod, requiring the shape and size of the ultrasonic vibrating rod 2 It should be adapted to the shape and size of the inner hole of the metal part 1 for the ultrasonic polishing process.

[0025] The number of the ultrasonic vibrating rod 2 can be multiple, and its quantity and position distribution are determined according to the number and position distribution of the inner holes on the metal part 1, and only one ultrasonic vibrating rod can b...

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Abstract

The invention provides a method for polishing an inner hole of a selective laser melting (SLM) metal part. According to the method for polishing the inner hole of the SLM metal part, when the metal part containing the inner hole is manufactured by using an SLM technology, an ultrasonic vibrating rod is corresponding formed in the inner hole; and after the metal part is formed, a vibrating rod installation seat which is connected with the ultrasonic vibrating rod in the inner hole is continuously formed, and is subsequently connected with an ultrasonic equipment transducer, so that the ultrasonic vibration polishing in which a grinding material is added can be performed. According to the method, the manufacturing time of an ultrasonic polishing tool is eliminated, and a plurality of inner holes can be simultaneously polished. The method is low in cost, high in efficiency, high in adaptability to the hole, and simple and accurate in positioning.

Description

technical field [0001] The invention belongs to the field of laser processing, and in particular relates to an inner hole polishing method of a metal part formed by selective laser melting. Background technique [0002] Selective Laser Melting (SLM) technology is a technology that utilizes the metal powder to be completely melted under the heat of the laser beam, and then realize metallurgical cladding and forming with solid metal through heat dissipation and cooling. SLM formed parts have a wide range of applications, such as tools and molds in the mechanical field (micro-manufactured parts, micro-devices, tool inserts, molds), bio-implanted parts or replacement parts (teeth, vertebrae) in the biomedical field, and in the electronics field. Heat dissipation devices, ultra-light structural parts in the aerospace field, functionally gradient composite material parts, etc. A typical process of using SLM technology to directly form metal parts is: according to the layered slic...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24B1/04
Inventor 曹宇李峰平赵宗礼周余庆胡雪林
Owner WENZHOU UNIVERSITY
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