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Manufacturing method of electroluminescent device and method of manufacturing electrode substrate

The technology of an electroluminescent device and its manufacturing method is applied in the direction of circuits, electric components, electric solid-state devices, etc., and can solve the problems of poor uniformity of light emission and high impedance of transparent electrodes, etc.

Inactive Publication Date: 2015-08-26
华映视讯(吴江)有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, in general, the resistivity of transparent conductive materials is still higher than that of metal conductive materials, so when the organic light-emitting diode light-emitting device requires a larger surface light source design and the corresponding electrode is enlarged, it is easy to cause the transparent electrode impedance to be higher than that of the metal conductive material. High and lead to problems such as poor uniformity of light emission

Method used

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  • Manufacturing method of electroluminescent device and method of manufacturing electrode substrate
  • Manufacturing method of electroluminescent device and method of manufacturing electrode substrate
  • Manufacturing method of electroluminescent device and method of manufacturing electrode substrate

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Embodiment Construction

[0030] Please refer to Figure 1 to Figure 8 . Figure 1 to Figure 8 A schematic diagram of a method for manufacturing an electrode substrate of an electroluminescent device according to a preferred embodiment of the present invention is shown. in image 3 and Figure 8 For the top view diagram, figure 2 for along image 3 The cross-sectional schematic diagram drawn by the section line A-A', Figure 7 for along Figure 8 The cross-sectional schematic diagram drawn by the section line B-B'. For the convenience of description, the drawings of the present invention are only schematic diagrams for easier understanding of the present invention, and the detailed proportions thereof can be adjusted according to design requirements. The manufacturing method of the electrode substrate of the electroluminescent device of this embodiment includes the following steps. First, if figure 1 As shown, a substrate 110 is provided, and the substrate has an upper surface 110A and a lower...

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Abstract

The invention discloses a method for manufacturing an electrode substrate of an electroluminescent device. The method comprises the following steps of forming at least one first electrode and at least one second electrode on a substrate; forming a metal layer to cover the first and second electrodes and the substrate; forming an amorphous transparent conducting layer on the metal layer; patterning the amorphous transparent conducting layer to obtain an amorphous transparent conducting pattern; crystallizing the amorphous transparent conducting pattern to convert the amorphous transparent conducting pattern into a crystallized transparent conducting pattern; and taking the crystallized transparent conducting pattern as a mask, moving the metal layer which is not covered by the non-crystallized transparent conducting pattern, so that at least one first metal electrode pad and at least one metal auxiliary electrode are formed on the first electrode and at least one second metal electrode pad is formed on the second electrode.

Description

technical field [0001] The invention relates to a manufacturing method of an electrode substrate, in particular to an electrode substrate of an electroluminescent device and a manufacturing method of the electroluminescent device. Background technique [0002] Organic light-emitting diodes (Organic Light-Emitting Diode, OLED) have been widely used in various light-emitting devices such as backlights of liquid crystal displays and organic light-emitting diodes due to their advantages of high luminous efficiency, no mercury (Hg) and surface light on the monitor. Conventional OLED light-emitting devices use transparent conductive materials such as indium tin oxide (ITO) to form electrodes to reduce the impact on the light-emitting effect. However, in general, the resistivity of transparent conductive materials is still higher than that of metal conductive materials, so when the organic light-emitting diode light-emitting device requires a larger surface light source design and...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L51/56H01L51/52
Inventor 张锡明
Owner 华映视讯(吴江)有限公司