The invention discloses a
wafer cleaning liquid concentration
dynamic monitoring system, and belongs to the technical field of
semiconductor manufacturing. Aiming at the problems of large
single parameter measurement error, poor equipment adaptability and frequent maintenance in the prior art, the invention provides a multi-
physics field fusion detection scheme: acquiring
ion concentration characteristics through a multi-frequency
conductivity detection module (0.1 kHz to 10MHz), eliminating environmental interference in combination with a temperature-
viscosity joint compensation module, and calculating the concentration of the
ion in the multi-frequency
conductivity detection module. An optical
refractive index auxiliary
verification module is used to realize cross
verification, and a CNN-LSTM fusion model optimized by transfer learning is used to improve cross-device prediction precision. According to the innovativeness of the
system, an anti-
corrosion annular
electrode array (
titanium alloy iridium-plated) supports dynamic distance adjustment and pulse self-cleaning, an ultrasonic defoaming unit (1-3 MHz frequency self-adaption) restrains bubble interference, and a self-calibration module triggers online maintenance based on the conditions of the
electrode impedance change rate (larger than or equal to 5%), temperature fluctuation and the like. Experiments show that the concentration
measurement precision is improved to + / -0.5%, the HF / O3
rate ratio is controlled to be (1: 2.5 + / -0.3), the number of residual particles on the surface of the
wafer is smaller than or equal to 5 per square inch, the service life of the
electrode is prolonged to 8 months, and the yield is improved by 0.6%. The method is suitable for a
wafer production line of 12 inches and above, and has the advantages of high precision, strong anti-interference and low maintenance cost.