The invention relates to a super-junction
MOSFET device, and the device comprises a first
column structure and a second
column structure which are located at the same side of a substrate and are sequentially arranged in the same direction parallel to the surface of the substrate; the opposite surfaces of the first
column structure and the second column structure are in contact, and the
doping types of the first column structure and the second column structure are different; the island structures and the first column structures are located on the same side of the substrate, and the island structures are located on the sides, away from the second column structures, of the first column structures; the island structures are sequentially arranged in the direction perpendicular to the surface of the substrate, the opposite surfaces of every two adjacent island structures make contact with each other, and the
doping types of every two adjacent island structures are different; wherein the island structure is in contact with opposite surfaces of the first pillar structure; a well structure; a gate polysilicon layer; due to two times of
recovery of the hole, the
current decay time is prolonged, soft
recovery is realized, and EMI oscillation is inhibited.