Quick response energy storing heat dissipation plate

Abstract

The invention discloses a quick response energy storing heat dissipation plate which comprises foam materials (1), a radiant plate (2) and phase-change materials (3). The radiant plate (2) comprises a plurality of inner cavities with regular shapes and even sizes. Some inner cavities are filled with the foam materials (1), and the rest of the inner cavities are filled with a large number of minitype heat pipes made of cycle fluid. The phase-change materials (3) are heated to be filled to the gaps of the foam materials (1) in a liquid state, and the periphery of the radiant plate (2) is sealed after the phase-change materials (3) are cooled and solidified. The quick response energy storing heat dissipation plate has the performance of large heat capacity, large thermal diffusivity and the like by utilizing the high heat-conducting property of the minitype heat pipes, the large specific surface area of the foam materials and the large phase-change latent heat of the phase-change materials. The quick response energy storing heat dissipation plate can be applied to electron devices for spaceflight, wherein the electron devices are small in size, high in heat flux and periodic in operation. The quick response energy storing heat dissipation plate has the advantages of being high in heat response speed and temperature control precision, large in short-term absorption heat, light in weight, reliable in system and the like.

Description

technical field [0001] The invention relates to a cooling device, more specifically, to a fast-response energy storage cooling plate. The invention belongs to the field of spacecraft thermal control. Background technique [0002] The driving force for the development of spacecraft thermal control technology mainly comes from the needs of future mission development of spacecraft. For spacecraft thermal control systems, key factors driving development include power levels, temperature levels controlled, temperature control accuracy, instrument heat flux, heat transport distance, and effective heat sinks for heat dissipation. [0003] With the development of space technology, the local or instantaneous power of some equipment can be as high as hundreds of watts per square centimeter, such as laser diodes, high-power sensor chips, high-power directed energy weapons, etc. Existing cooling methods can no longer meet the requirements. In recent years, the microchannel evaporative...

AI Technical Summary

Problems solved by technology

When the device volume is relatively small and the power density is relatively large, ordinary heat pipes cannot effectively dissipate heat due to the relatively large contact thermal resistance.

This not only causes the problem of increasing the weight of the spacecraft, but also may cause damage to the components due to the inability to effectively dissipate heat, reducing the reliability of the entire star

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