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Metamaterial and preparation method thereof

A metamaterial and ultra-thin technology, applied in circuit substrate materials, chemical instruments and methods, lamination, etc., can solve the problems of large loss and excessive weight of metamaterials, and achieve the effect of low density, stable electromagnetic properties, and easy portability.

Inactive Publication Date: 2013-09-11
KUANG CHI INST OF ADVANCED TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to overcome the defects of overweight and excessive loss of metamaterials in the prior art, and provide a metamaterial with light weight and low loss, which brings great convenience to the manufacture of electromagnetic products

Method used

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  • Metamaterial and preparation method thereof

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preparation example Construction

[0029] The present invention also provides a method for preparing a metamaterial, the method comprising:

[0030] (1) Foaming the resin matrix by a foaming method to make a rigid foam, the foam voids of the rigid foam are adjusted according to the strength requirements of the metamaterial, and the artificial microstructure is etched on the PCB substrate The ultra-thin substrate is made, and the foaming method includes a chemical foaming method and a physical foaming method.

[0031] (2) Bonding the obtained rigid foam and the ultra-thin substrate together with an adhesive.

Embodiment 1

[0034] Polyurethane, phenolic, epoxy, polystyrene, polyester, polyamide and other resin substrates are foamed by physical foaming methods, and rigid foams are made, and artificial microstructures are etched on a PCB substrate with a thickness of 0.1mm. Ultra-thin substrate with a density of 0.57g / cm 3 ; The obtained rigid foam and the ultra-thin substrate are bonded together by an adhesive.

Embodiment 2

[0036] Polyurethane, phenolic, epoxy, polystyrene, polyester, polyamide and other resin substrates are foamed by physical foaming methods, and rigid foams are made, and artificial microstructures are etched on a PCB substrate with a thickness of 0.07mm. Ultra-thin substrate with a density of 0.45g / cm 3 ; The obtained rigid foam and the ultra-thin substrate are bonded together by an adhesive.

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Abstract

The invention relates to the field of a metamaterial. The metamaterial comprises ultrathin substrates and rigid foams, wherein the ultrathin substrates are bonded with the rigid foams alternately by adhesives. The invention also provides a preparation method of the metamaterial. The metamaterial is made from the rigid foams, thus being smaller in density, lighter in weight and convenient to carry; furthermore, the metamaterial has the characteristics of being corrosion-resistant, impact-resistant, fireproof, damp-proof, sound-proof, shock-proof and the like; by adopting the printed circuit board (PCB) substrates etched with man-made micro-structures, the metamaterial has a better and more stable electromagnetic property.

Description

technical field [0001] The invention relates to the field of dielectric substrates, in particular to a metamaterial and a preparation method thereof. Background technique [0002] At present, the realization of the metamaterial structure is mainly completed by making metal wires on the PCB. The substrate used in the PCB generally has a glue content of about 50% and a density of about 1.6. Therefore, the weight of the metamaterial obtained by laminating the multilayer board is relatively heavy. It brings a lot of trouble to the lightweight of most electromagnetic products. [0003] At the same time, the loss of PCB substrates sold in the market is relatively large, especially in the microwave field, excessive loss will greatly reduce the efficiency of metamaterials. [0004] The dielectric constant of ordinary PCB boards is relatively high, such as the dielectric constant of F4B is as high as 2.5, so metamaterials prepared using this type of boards cannot meet the requiremen...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B27/06B32B7/12B32B37/15B32B37/12H05K1/03
Inventor 刘若鹏季春霖岳玉涛黄新政
Owner KUANG CHI INST OF ADVANCED TECH