Feeding system of lead frame array

A lead frame and array technology, used in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve problems such as low efficiency in the feeding process, incorrect placement of lead frame arrays, and reverse placement of lead frames, and achieve automatic and fast loading. material, avoid wrong feeding, and ensure the effect of accuracy

Inactive Publication Date: 2013-09-11
WUXI CHINA RESOURCE MICRO ASSEMBLY TECH
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Problems solved by technology

[0005] However, the loading process of the lead frame array in the prior art is usually done manually. Therefore, the efficiency of the loading process is low, while the placement efficiency of SMT is high, and the time for manually placing the lead frame to the DBC substrate jig is far away. It is higher than the chip mounting time, therefore, the lead frame loading process restricts the improvement of packaging efficiency
[0006] In addition, the automation of the manual lead frame array loading process is low. During the material loading process, lead frame array placement errors (for example, reverse lead frame, wrong lead frame) are prone to occur, which affects the packaging process and packaging. product quality

Method used

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  • Feeding system of lead frame array
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  • Feeding system of lead frame array

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Embodiment Construction

[0026] The following introduces some of the possible embodiments of the present invention, which are intended to provide a basic understanding of the present invention, but are not intended to identify key or decisive elements of the present invention or limit the scope of protection. It is easy to understand that, according to the technical solution of the present invention, those skilled in the art may propose other alternative implementation manners without changing the essence and spirit of the present invention. Therefore, the following specific embodiments and drawings are only exemplary descriptions of the technical solution of the present invention, and should not be regarded as the entirety of the present invention or as a limitation or restriction on the technical solution of the present invention.

[0027] In the drawings, the thicknesses of layers and regions are exaggerated for clarity, and shape features such as roundness due to etching are not illustrated in the ...

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Abstract

The invention provides a feeding system of a lead frame array and belongs to the technical field of encapsulation. The feeding system of the lead frame array comprises a material pushing device, a sucking module, a detecting module and a transferring module. The material pushing device is used for pushing the lead fame array out of a lead frame array material box. The sucking module is provided with a plurality of suction nozzles used for sucking the lead frame array, and the detecting module is provided with a detection sensor used for detecting the placing direction and the type of the lead frame array. The transferring module is used for transmitting the lead frame array sucked by the sucking module to a reserved part. The feeding system of the lead frame array is high in degree of automation. The lead frame array is little in deformation and high in encapsulation efficiency in the process of feeding. In addition, the accuracy of feeding load is high.

Description

technical field [0001] The invention belongs to the technical field of packaging, and relates to a mounting fixture for a direct bonding copper (Direct Bonding Copper, DBC) substrate. Background technique [0002] The lead frame is one of the main carriers for packaging chips. Before packaging and bonding, the process of material loading and other processes is carried out in the form of a lead frame array, which is conducive to improving the packaging efficiency. [0003] In the packaging production line, it is usually necessary to position the lead frame array on the predetermined component first, which is called the loading process of the lead frame array. For example, the lead frame array needs to be positioned and loaded into the predetermined DBC (Direct Bonding Copper, direct Bonding copper) on the substrate fixture; then complete SMT (Surface Mounted Technology, surface mount technology) mounting on the DBC substrate. [0004] SMT (Surface Mounted Technology) is ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/677H01L21/67
Inventor 龚平周勰科刘晓明
Owner WUXI CHINA RESOURCE MICRO ASSEMBLY TECH
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