Camera device and manufacturing method thereof

A camera device and camera surface technology, which is applied in installation, image communication, instruments, etc., can solve problems such as difficult handling of camera devices, achieve the effects of shortening positioning operations and improving manufacturing efficiency

Inactive Publication Date: 2016-12-21
OLYMPUS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] However, in the case of an imaging device having a prism that allows light to enter from a direction intersecting the optical axis of the imaging element like a prism that is bonded like a triangular prism, and uses a reflective surface to reflect the incident light to enter the imaging element. , since the reflective surface is arranged obliquely with respect to the imaging element, it is difficult to process it by the imaging device formed into a single piece after adsorption and cutting

Method used

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  • Camera device and manufacturing method thereof
  • Camera device and manufacturing method thereof
  • Camera device and manufacturing method thereof

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Embodiment Construction

[0050] Hereinafter, an imaging device 1 and a manufacturing method thereof according to an embodiment of the present invention will be described with reference to the drawings.

[0051] Such as figure 1 and figure 2 As shown, the imaging device 1 of this embodiment includes a flat imaging element 2 , a triangular prism 3 fixed to the surface of the imaging element 2 , and a cover member 4 fixed to cover the triangular prism 3 . In the drawings, reference numeral 5 is a transparent cover glass covering the imaging surface 2 a of the imaging element 2 and constituting a part of the imaging element 2 .

[0052] The imaging element 2 is manufactured on a silicon wafer by semiconductor manufacturing technology, has an imaging surface 2a on which light is incident, and forms an image by converting light incident on the imaging surface 2a into an electrical signal.

[0053] The triangular prism 3 comprises a mutually orthogonal incident surface 3a and an outgoing surface 3b, and a...

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Abstract

It can be easily produced, and can be easily adsorbed and handled even in the state of forming a single piece. Provided is an imaging device (1), comprising: imaging element (2); The incident surface (3a) that is incident in the direction of the imaging element (2), the outgoing surface (3b) that is approximately parallel to the imaging surface (2a) of the imaging element (2), and the direction of light incident on the incident surface (3a) is along the direction of the imaging element (2) A reflective surface (3c) deflected in the direction of the optical axis (A); and a cover member (4), which is fixed at a position covering the reflective surface (3c) of the prism (3), and has a substantially parallel to the imaging surface (2a) outer surface (4a).

Description

technical field [0001] The invention relates to an imaging device and a manufacturing method thereof. Background technique [0002] Conventionally, a method of manufacturing a plurality of optical heads by bonding rod-shaped prisms to a plurality of semiconductor elements produced on a silicon wafer and then cutting the integrally formed silicon wafer, semiconductor elements, and prisms is known. [0003] Patent document: Japanese Patent Laid-Open No. 63-127444 [0004] However, in the case of an imaging device having a prism that allows light to enter from a direction intersecting the optical axis of the imaging element like a prism that is bonded like a triangular prism, and uses a reflective surface to reflect the incident light to enter the imaging element. , since the reflective surface is arranged obliquely with respect to the imaging element, it is difficult to handle it by the imaging device formed into a single piece after suction cutting. Contents of the inventi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H04N5/225G02B7/18
CPCH01L27/14618H01L27/14623H01L27/14625H01L2924/0002H04N23/57H04N23/55H01L2924/00
Inventor 折原达也金野光次郎
Owner OLYMPUS CORP
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