Method of increasing thermal conductivity of ceramic element
A technology of ceramic components and thermal conductivity, which is applied in the field of increasing the thermal conductivity of ceramic components, can solve problems such as poor thermal conductivity, difficulty in achieving reliability of ceramic components 100, and non-dense ceramic components 100, so as to achieve the effect of extension and reliability
Inactive Publication Date: 2013-09-25
LEXTAR ELECTRONICS CORP
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Problems solved by technology
Conversely, the coarser the particle size of the powder, the less dense the sintered ceramic element 100 will be, so that the ceramic element 100 has larger pores 110, and the sintered ceramic element 100 has poorer thermal conductivity.
[0004] However, the ceramic element 100 made of high-quality powder has better thermal conductivity, but is very expensive, thus causing an increase in material cost
In addition, the internal cracks of the ceramic element 100 will be affected by the environment or internal stress, and the cracks in the crystal phase structure will gradually become larger, often resulting in cracks and damage.
Cause too many defective products, low pass rate
That is to say, it is not easy for the manufacturer to ensure the reliability of the ceramic element 100.
Method used
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[0037] A number of embodiments of the present invention will be disclosed below with the accompanying drawings. For the sake of clarity, many practical details will be described together in the following description. It should be understood, however, that these practical details should not be used to limit the invention. That is, in some embodiments of the present invention, these practical details are unnecessary. In addition, for the sake of simplifying the drawings, some known and conventional structures and elements will be shown in a simple and schematic manner in the drawings.
[0038] figure 2 A partially enlarged view of a high thermal conductivity ceramic element 200 according to an embodiment of the present invention is shown. As shown in the figure, the ceramic element 200 has a plurality of pores 210 , and the fluid 220 is solidified in the pores 210 to reduce the porosity of the ceramic element 200 . Since the pores 210 of the ceramic element 200 are filled by...
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The invention discloses a method of increasing thermal conductivity of a ceramic element. The method of increasing thermal conductivity of a ceramic element has the following steps of providing a sintered ceramic element with a plurality of holes; making fluids seeped inside the holes of the ceramic element and further fill the holes; and solidifying fluids inside the holes.
Description
technical field [0001] The present invention relates to a method of increasing the thermal conductivity of ceramic components. Background technique [0002] Ceramic material is a material with a high melting point, which not only has hard and brittle mechanical properties, but also has good chemical stability. Ceramic materials are often used in devices under high temperature and harsh environments to maintain the reliability of their characteristics. [0003] Generally speaking, the manufacturing process of ceramic components requires high temperature sintering. Because most of the powders used for sintering will have fine cracks in the crystal structure after the sintering process, it may easily cause unexpected cracks during use or transportation, which makes it difficult to improve the qualified rate of the product. In addition, the crystalline structure of the ceramic element after sintering has porosity. Due to the poor thermal conductivity of air, too high porosity ...
Claims
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IPC IPC(8): C04B41/83
Inventor 周士钦
Owner LEXTAR ELECTRONICS CORP