Waste mortar separating and recycling technology for cutting silicon slice

Abstract

The invention discloses a waste mortar separating and recycling technology for cutting a silicon slice. The waste mortar separating and recycling technology comprises the following steps of: (1) separating and recycling silicon slice cutting liquid, namely diluting and roughly filtering waste mortar, decoloring filtrate by active carbon, finely filtering the filtrate to remove micro particles from the filtrate, removing free electrons from the filtrate, and evaporating to remove water in the filtrate, thus obtaining regenerated silicon slice cutting liquid; and (2) recycling carbonized silicon and monocrystal silicon solid mixtures, namely taking out solid filtered residues, adding purified water into the solid filtered residues, conveying the solid filtered residues and purified water mixtures into a second plate frame press filter for filtration, taking out the solid slag, and performing separation squeezing to obtain the carbonized silicon and monocrystal silicon solid mixtures. According to the waste mortar separating and recycling technology, when the silicon slice cutting liquid in the waste mortar is recycled, carbonized silicon micro powder and monocrystal solids in the silicon slice cutting liquid are also recycled and used, so that the recycling rate is high; the recycled silicon slice cutting liquid has the same surface activity, the same suspension and the same carrying force as those of new cutting liquid and can be repeatedly used; the cost is saved; the economic benefit of the solar industry is improved.

Description

technical field [0001] The invention relates to the technical field of solar cell silicon chip cutting, in particular to a waste mortar separation and recovery process for silicon chip cutting. Background technique [0002] Silicon wafer cutting is a key part of the solar photovoltaic cell manufacturing process. It is used to process solid silicon ingots of monocrystalline silicon or polycrystalline silicon. Specifically, a wire saw is used to cut the silicon ingot into squares and further cut into very thin silicon wafers. These silicon wafers Used as a substrate for the manufacture of photovoltaic cells. Wire saw refers to the ultra-fine high-strength cutting wire used to complete the cutting action under the cooperation of abrasive slurry. Hundreds of cutting wires are wound parallel to each other on the wire wheel to form a horizontal cutting wire network. The motor drives the wire wheel to make the entire cutting wire network Moving at a speed of 5 to 25 meters per sec...

AI Technical Summary

Problems solved by technology

At present, some photovoltaic manufacturers have begun to recycle waste mortar, but due to the imperfect process, the treatment effect is not very satisfactory. After the recycled cutting fluid and silicon carbide powder are put into use again, th