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Adhesive for inorganic fibers

A technology of inorganic fibers and adhesives, applied in the direction of inorganic adhesives, adhesives, non-polymer adhesive additives, etc., can solve the problem of less adhesives and achieve high heat resistance

Active Publication Date: 2013-10-02
NICHIAS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Conventionally, the use of various inorganic binders has been proposed (for example, Patent Documents 1 to 5), but there are few binders for molded articles of biosoluble inorganic fibers.

Method used

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  • Adhesive for inorganic fibers
  • Adhesive for inorganic fibers
  • Adhesive for inorganic fibers

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0110] [manufacture of adhesive]

[0111] Mixed fused silica 24% by weight, colloidal silica (inorganic binder) 21% by weight, CMC (organic binder) (Sunrose, manufactured by Nippon Paper Chemicals Co., Ltd.) 1.7% by weight, water (solvent) 53% by weight %, preservative (Deltop, manufactured by Japan Enviro Chemicals Co., Ltd.) 0.3% by weight (combination 1), and an adhesive was produced.

[0112] The composition of the inorganic components contained in the obtained adhesive is SiO 2 98% by weight, 1.1% by weight of Na, and 0.9% by weight of others. The inorganic components contained in the adhesive are components obtained by removing the solvent and the organic binder by drying and firing the adhesive. The obtained inorganic components were measured by fluorescent X-ray analysis to determine the composition. Viscosity was measured with a B-type viscometer, and the result was about 30 to 40 Pa·S.

[0113] [Evaluation of bonding part]

[0114] From biosoluble fiber (SiO 2 ...

Embodiment 2～45

[0121] Embodiment 2~45, comparative example 1~5

[0122] [Manufacture and evaluation of adhesives]

[0123] In the same manner as in Example 1, adhesives were produced in the formulations shown in Tables 1 to 5, and evaluated. The evaluation results are shown in Tables 1-5.

[0124] [Table 1]

[0125]

[0126] [Table 2]

[0127]

[0128] [table 3]

[0129]

[0130] [Table 4]

[0131]

[0132] [table 5]

[0133]

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PUM

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Abstract

Provided is a zeolite-free adhesive for inorganic fibers that contains SiO2, CaO, and Al2O3 within a range excluding range I enclosed by the following point A, point 8, point 18, point 19, and point 20 in the phase diagram of SiO2-Al2O3-CaO shown in Fig. 1, where point A is SiO2 (0%) Al2O3 (100%) CaO (0%), point 8 is SiO2 (20.8%) Al2O3 (79.2%) CaO (0%), point 18 is SiO2 (46.3%) Al2O3 (35.8%) CaO (17.9%), point 19 is SiO2 (31.5%) Al2O3 (53.6%) CaO (14.9%), and point 20 is SiO2 (25.2%) Al2O3 (57.5%) CaO (17.3%).

Description

technical field [0001] The present invention relates to a novel adhesive for inorganic fibers, particularly an adhesive suitable for bonding moldings containing biosoluble inorganic fibers. Background technique [0002] Inorganic fibers are light, easy to handle, and have excellent heat resistance, so they are used, for example, as heat-resistant sealing materials. On the other hand, it has been pointed out in recent years that inorganic fibers have a problem of being inhaled by the human body and invading the lungs. Therefore, biosoluble inorganic fibers that do not cause problems or hardly cause problems even if they are inhaled by the human body are being developed. [0003] These biosoluble inorganic fibers are, for example, processed into molded bodies such as mats and blocks, bonded to each other with an adhesive, and then applied to furnace walls or the like, or applied to furnace walls while being bonded. Molded products of biosoluble inorganic fibers are used at t...

Claims

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Application Information

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IPC IPC(8): C09J1/00C09J11/04C09J201/00
CPCC09J1/00C09J11/04C09J201/00
Inventor 米内山贤三原彻也石原铁也岸木智彦
Owner NICHIAS CORP