Underfill adhesive composition

Abstract

The invention discloses an underfill adhesive composition and belongs to the field of chemical adhesives. The underfill adhesive composition is prepared from the following raw materials in parts by weight: 50 to 80 parts of hydrogenated epoxy resin, 1 to 10 parts of modified resin, 10 to 30 parts of toughened resin and 1 to 5 parts of a complexing curing agent. A preparation method of the underfiller composition comprises the following steps of: adjusting the temperature of the production environment to 15-28 DEG C and the relative humidity to be less than 70 percent; adding the hydrogenated epoxy resin into a vacuum stirring kettle sequentially according to the formula sequence and stirring; adding the modified resin uniformly and mixing uniformly; adding the curing agent and mixing uniformly; performing vacuum mixing uniformly; defoaming, filtering, split-charging, putting into a storage and performing refrigeration at minus 20 DEG C. The underfill adhesive has low viscosity, can be used for avoiding preheating during use and has high curing speed.

Description

technical field [0001] The invention relates to an adhesive, in particular to an underfill adhesive composition for a flip chip. Background technique [0002] Flip-chip is a leadless structure, which generally contains circuit units. The principle is to deposit tin-lead balls on the I / Opad, and then flip the chip to heat and combine the molten tin-lead balls with the ceramic plate. Flip-chip packaging technology and Compared with the traditional wire bonding process, it has many obvious advantages, such as eliminating the requirement for wire bonding connection, increasing the connection density of input / output (I / O), smaller package size and superior electrical and thermal performance, etc. , Therefore, this technology has replaced conventional wire bonding and has gradually become the mainstream of future packaging technology. [0003] In flip-chip technology, the soldered component materials include different types of organic and inorganic materials, all of which have in...

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Problems solved by technology

[0007] 2. The curing conditions can match the existing production process, and the longer curing time may become the bottleneck of the production line;

[0014] 1. The viscosity is high, generally around 3000cps, the fluidity is very poor at room temperature, and it is easy to generate air bubbles during the flow process, so it needs to be preheated to 50-80°C to improve its fluidity;

[0015] 2. The curing time is long, and it takes 15-30 minutes to cure above 150°C, which is easy to become the bottleneck of the production line;

[0016] 3. From the perspective of energy cost, the consumption of energy is relatively large

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