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Dust-proofing thin film assembly

A dust-proof film component and a technology of dust-proof film, which are applied to the original parts, optics, instruments, etc. for photomechanical processing, and can solve the problems of photomask damage and adhesive layer being easily crushed.

Active Publication Date: 2013-10-30
SHIN ETSU CHEM IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] Therefore, if the pellicle is pressed against the photomask, etc., the adhesive layer is easily crushed, and the photomask, etc. may be damaged after the frame comes into contact with the photomask, etc.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0056] A rectangular aluminum alloy frame with an outer dimension of 782×474mm, an inner dimension of 768×456mm, a height of 5.0mm, a radius of 2.0mm on the inside of the corner, and a radius of 6.0mm on the outside is obtained by machining, and is made of SUS beads. After sandblasting to obtain a rough surface with Ra of 0.5-1.0 μm, black oxide film treatment is carried out.

[0057] Move this frame into a clean room, wash it thoroughly with neutral detergent and pure water, and dry it.

[0058] Then, to silicone resin adhesive X-40-3122 (trade name manufactured by Shin-Etsu Chemical Co., Ltd., hardness: A-type durometer measurement value: 15), silicone rubber powder was added as a spacer. (manufactured by Shin-Etsu Chemical Co., Ltd., maximum particle size: 500 μm, hardness: A-type hardness tester measurement value 40), so that the content was 30% by volume to obtain an adhesive containing a spacer.

[0059] In addition, the hardness of the space agent was measured after be...

Embodiment 2

[0063] In the silicone resin adhesive X-40-3122, silicone rubber powder X-52-875 (manufactured by Shin-Etsu Chemical Co., Ltd., maximum particle size: 50 μm, hardness: A-type durometer Measured value 40) was added until it became 30% by volume to obtain an adhesive containing a spacer, and a pellicle was produced in the same manner as in Example 1. The thickness of the adhesive layer is 1.0mm.

Embodiment 3

[0065] Add silicone rubber powder (manufactured by Shin-Etsu Chemical Co., Ltd., maximum particle size: 300 μm, hardness: A-type durometer value 40) as a spacer to the silicone resin adhesive X-40-3122 until its volume becomes 50% by volume to obtain an adhesive containing a spacer. Except for this, a pellicle was produced in the same manner as in Example 1. The thickness of the adhesive layer is 1.0mm.

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Abstract

The invention provides a dust-proofing thin film assembly which can prevent a photomask from being damaged because a frame is not contacted with the photomask even though the dust-proofing thin film assembly is pressed on the photomask in strong force. The dust-proofing thin film assembly attaches a dust-proofing thin film on one end face of the frame, and an adhesive layer is arranged on the other end face of the frame. The dust-proofing thin film assembly is characterized in that the adhesive layer contains an adhesive and a particle space agent. The hardness of the space agent, measured by an A durometer, is lower than 80, so that the space agent is harder than the adhesive.

Description

technical field [0001] The present invention relates to a pellicle pellicle for photolithography used in dust removers during the manufacture of semiconductor devices, printed boards, liquid crystal panels, etc. layer of dust pellicle components. Background technique [0002] A photomask or reticle (hereinafter referred to as "" When there is dust attached in the photomask, etc.), the dust absorbs light and reflects light, and the transferred pattern is deformed, the edges are not uniform, and the wafer, etc. will become dirty and black, making the size, The quality, appearance, etc. are impaired, and thereby there is a problem that the performance and production yield of semiconductor manufacturing equipment and liquid crystal manufacturing equipment are lowered. [0003] Therefore, these operations are usually performed in a clean room. However, even in a clean room, it is difficult to keep the photomask etc. clean frequently. Therefore, on the surface of the photomask ...

Claims

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Application Information

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IPC IPC(8): G03F7/20
CPCG03F1/22G03F1/38G03F1/62G03F1/64G03F7/70916
Inventor 堀越淳
Owner SHIN ETSU CHEM IND CO LTD
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