Electronic product middle frame and processing method thereof

A technology for electronic products and side frames, which is applied to the middle frame of electronic products and its processing field, can solve the problems of heavy middle frame, high production cost, low production efficiency, etc. Effect

Inactive Publication Date: 2013-11-20
AOJIE HARDWARE JIANGSU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The technical problem to be solved by the present invention is: how to provide a middle frame of an electronic product and its processing method, so as to overcome the defects of the traditional middle frame of an electronic product such as heavy weight, poor performance, low production efficiency, complicated process, and high production cost.

Method used

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  • Electronic product middle frame and processing method thereof
  • Electronic product middle frame and processing method thereof
  • Electronic product middle frame and processing method thereof

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Experimental program
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Effect test

Embodiment 1

[0051] Such as figure 1 As shown, this embodiment describes a middle frame of an electronic product, including a panel 1 and a side frame 2 , the side frame 2 is formed by bending the edge of the panel 1 , and the side frame 2 surrounds the panel 1 along its surroundings.

[0052] figure 2 gives figure 1 From the cross-sectional view of the middle frame of the electronic product shown, the specific structure of the side frame of the middle frame of the electronic product can be seen. The side frame includes three extension parts, the first extension part 2-1 is perpendicular to the panel 1 and connected to the panel 1 through the first connection part 3-1, the second extension part 2-2 is connected to the first extension part 2-1 Connected by the second connection part 3-2, the second extension part 2-2 is close to and parallel to the first extension part 2-1, and the third extension part 2-3 and the second extension part 2-2 pass through the third The connection part 3-3 ...

Embodiment 2

[0089] Based on the first embodiment, this embodiment describes a method for processing a middle frame of an electronic product. Such as Figure 8 As shown, in the processing method for the middle frame of an electronic product described in Embodiment 1, after step S2 and before S3, there are steps:

[0090] ④. Trim the notches at the bends of the second connecting portion 3-2 and / or the third connecting portion 3-3, so as to eliminate wrinkles generated during bending.

[0091] Due to the bending process of the panel, due to extrusion, some wrinkles will be generated at the folds, and these wrinkles may cause the first extension part 2-1 and the second extension part 2-2 and the second extension part 2-2 and the second extension part 2-2 The three extensions 2-3 are not tightly fitted; even if the above-mentioned extensions are closely fitted, these folds may cause distortion of the side frame and affect the appearance. Therefore, according to the specific situation of the ...

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Abstract

The invention discloses an electronic product middle frame and a processing method thereof, and belongs to the technical field of electronic product components. The electronic product middle frame comprises a panel and a side frame which are integrally connected with each other, wherein the side frame comprises three extending parts; the first extending part is connected with the panel and is perpendicular to the panel; the second extending part is in tight fit with the first extending part and is parallel to the first extending part; the third extending part is in tight fit with the second extending part and is parallel to the second extending part; the third extending part and the first extending part are positioned on the same side of the second extending part. The electronic product middle frame adopts an integrated structure; the side frame is formed by bending and stamping the edge of the panel for many times, so that the structural strength is high; the electronic product middle frame is processed by a continuous die or an engineering die, the working procedure is simple, and the yield is high; processing equipment is simple; the utilization rate of raw materials is high; the production cost is low; the raw materials which are as thin as 0.3-0.8 mm can be used for processing the electronic product middle frame; therefore the finished product is light in weight and convenient to use and carry.

Description

technical field [0001] The invention relates to the technical field of electronic product components, in particular to an electronic product middle frame and a processing method thereof. Background technique [0002] At present, many high-end consumer electronic products are developing rapidly, and touch-screen smart phones and tablet computers have become increasingly popular. On the one hand, people have higher and higher requirements on parameters such as appearance and weight of electronic products; on the other hand, with the sharp increase in demand for such electronic products, industrial production has also put forward higher requirements for saving raw materials and simplifying production processes. Require. [0003] The middle frame of traditional electronic products is processed by combined stamping or CNC milling machine. The combined stamping method is used to process the middle frame, not only the process is complicated, the investment of manpower and materia...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/18B23P15/00
CPCH04M1/0202B21D19/14G06F1/1658H04M1/185
Inventor 施碧溪
Owner AOJIE HARDWARE JIANGSU
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