Unlock instant, AI-driven research and patent intelligence for your innovation.

Surface-enhanced Raman substrate and preparation method thereof

A surface-enhanced Raman and substrate technology, applied in Raman scattering, material excitation analysis, etc., can solve the problems of poor substrate repeatability, long-term aggregation, difficult chemical methods, etc., and achieve simple operation, high sensitivity and low cost. Effect

Inactive Publication Date: 2013-12-11
FUDAN UNIV
View PDF7 Cites 11 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This method is simple, but it is mostly only suitable for specific excitation wavelengths, and the sol is a metastable system, which is easy to aggregate for a long time, so the prepared substrate has poor reproducibility
To use the self-assembly method to make SERS active substrates with controllable surface plasmon resonance, there are usually two methods. One is to change the shape of the nano-sol, such as using a composite structure with adjustable parameters. By changing the shape of the nanoparticles, surface plasmons can be obtained. Nanoparticles with controllable resonance, and then assemble them into films to obtain nanofilms with different plasmon resonances. In this respect, the core-shell structure prepared by researchers at Rice University in the United States is more representative, but this method is relatively cumbersome. , and has the disadvantage of being difficult to control by chemical methods; another method is to change the degree of aggregation of nano-sols on the substrate, that is, to change the density of nanoparticles on the substrate. Repeatedly immersing the gold film several times to reduce the repulsion between gold nanoparticles to obtain SERS active substrates with different gold sol densities. This method has a limited controllable range of plasmon resonance and is time-consuming, usually 3-4 days

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Surface-enhanced Raman substrate and preparation method thereof
  • Surface-enhanced Raman substrate and preparation method thereof
  • Surface-enhanced Raman substrate and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0022] In order to make the objectives, technical solutions, and advantages of the present invention clearer, the various embodiments of the present invention will be described in detail below with reference to the accompanying drawings. However, a person of ordinary skill in the art can understand that in each embodiment of the present invention, many technical details are proposed for the reader to better understand the present application. However, even without these technical details and various changes and modifications based on the following embodiments, the technical solutions claimed by the claims of this application can be realized.

[0023] The first embodiment of the present invention relates to a surface-enhanced Raman substrate. The surface-enhanced Raman substrate includes a substrate and a metal layer covering the substrate, and the substrate has holes with a periodic lattice structure. Such as Figure 1A Is the top view of the surface enhanced Raman substrate, such...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
depthaaaaaaaaaa
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
Login to View More

Abstract

This invention relates to the technical field of Raman spectrum molecule detection, and discloses a surface-enhanced Raman substrate and a preparation method thereof. According to the present invention, a signal strength is enhanced through holes aligned on the surface of a substrate and having a periodical lattice structure so as to increase sensitivity and reduce detection limitation; and the technology that holes are punched on a substrate is a mature technology in a semiconductor manufacturing process, and the surface-enhanced Raman substrate has characteristics of low cost, simple process, easy operation, good Raman signal enhancement and good repeatability.

Description

Technical field [0001] The invention relates to the technical field of Raman spectroscopy molecular detection, in particular to a surface enhanced Raman substrate and a preparation method thereof. Background technique [0002] The development of life sciences has entered the era of detection and manipulation at the single cell and single molecule level. Because the optical method can directly image, and has the least interference to the research object, it has the advantages of non-destructive, in-situ measurement, etc., and has become the preferred research method for life sciences. Raman spectroscopy can obtain molecular vibrational energy level information, which is called molecular "fingerprint spectroscopy", which can provide detailed structural information of molecules, such as the type, strength, angle, and conformational changes of chemical bonds. However, the efficiency of ordinary Raman scattering is very low. Under normal circumstances, the Raman scattering cross sect...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G01N21/65
Inventor 李洁慧纪新明窦宏雁
Owner FUDAN UNIV