A modular led lamp body

Abstract

A modularized LED lamp main body element comprises a radiator (110), an LED crystal grain (121), and a light-pervious UV film (123). A heat radiation impact surface (113) is formed on a top surface of the heat radiator (110). A crystal distribution hole position (111) is arranged on the heat radiation impact surface (113). The LED crystal grain (121) is disposed in the crystal distribution hole position (111). The light-pervious UV film (123) is disposed on a top surface of the LED crystal grain (121), and the light-pervious UV film (123) and the LED crystal grain (121) are fixed in the crystal distribution hole position (111) in a packaged manner. The LED crystal grain (121) is provided with a connection wire (122). The heat radiation impact surface (113) is provided with a positive electrode contact and a negative electrode contact of a power supply. The connection wire (122) is electrically connected to the positive electrode contact and the negative electrode contact of the power supply. The modularized LED lamp main body element effectively improves the heat radiation efficacy and the stability, reduces later-period assembly work procedures, improves the production efficiency, and greatly improves the product quality and the service life of a product.

Description

technical field [0001] The invention relates to the technical field of LED lamps, in particular to a modular LED lamp main body. Background technique [0002] With the emergence of LED lighting technology, LED lighting fixtures are widely used in various places. At present, the LED lamps provided by the existing technology have poor heat dissipation and overheating, which promotes premature aging of the LED chip light source until the entire lamp is extinguished, reducing the The original design efficiency and life of the lamp are guaranteed. At the same time, there is a demand for improving the diversity of lighting functions of lamps and lanterns. In the formal production process, in the high-level assembly of each link, improper operation is prone to occur, resulting in a high defect rate of products, resulting in an increase in production costs. . For example: in the packaging process of COB chips, improper artificial force, artificial electrostatic shock, poor bonding...

AI Technical Summary

Problems solved by technology

[0002] With the emergence of LED lighting technology, LED lighting fixtures are widely used in various places. At present, the LED lamps provided by the existing technology have poor heat dissipation and overheating, which promotes premature aging of the LED chip light source until the entire lamp is extinguished, reducing the The original design efficiency and life of the lamps and lanterns are guaranteed

At the same time, there is a demand for improving the diversity of lighting functions of lamps and lanterns. In the formal production process, in the high-level assembly of each link, improper operation is prone to occur, resulting in a high defect rate of products, resulting in an increase in production costs.

For example: in the packaging process of COB chips, improper artificial force, artificial electrostatic shock, poor bonding of chips to heat sinks, and a series of common problems such as burn-in, which increase production costs and are the main factors for short service life in LED lamps

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