The present invention relates to an electroconductive paste useful in the manufacture of
silicon solar cells and
solar cell modules, especially for the backside of the
silicon wafer. The electroconductive paste comprises metallic particles, glass
frit, organic vehicle, and an adhesion
enhancer. The adhesion
enhancer comprises a
metal or a
metal oxide, or any other
metal compound that will convert to metal or metal
oxide at firing temperature. The adhesion
enhancer comprises at least one metal selected from the group consisting of
tellurium,
tungsten,
molybdenum,
vanadium,
nickel,
antimony,
magnesium,
zirconium, silver,
cobalt,
cerium, and
zinc, or oxides thereof. Preferably, the adhesion enhancer is
tellurium or
tellurium dioxide, and may be present in an amount of about 0.01-5 wt. % (based upon 100% total weight of the paste). The glass frits can be leaded or lead-free and may be present in an amount of about 1-10 wt. %. The metallic particles can be any of silver, aluminum, gold or
nickel, or any alloys thereof, and can be present in an amount of about 40-75 wt. %. Another aspect of the present invention relates to a
solar cell printed with an electroconductive paste composition on its backside, as well as an assembled
solar cell module. Another aspect of the present invention relates to
soldering pads formed by the present invention electroconductive paste composition on a
silicon substrate, wherein the
pull force required to remove the
soldering pad from the silicon substrate is above 1 Newton. An additional aspect of the present invention relates to a method of producing a solar
cell.