The present invention relates to an electroconductive paste useful in the manufacture of silicon solar cells and solar cell modules, especially for the backside of the silicon wafer. The electroconductive paste comprises metallic particles, glass frit, organic vehicle, and an adhesion enhancer. The adhesion enhancer comprises a metal or a metal oxide, or any other metal compound that will convert to metal or metal oxide at firing temperature. The adhesion enhancer comprises at least one metal selected from the group consisting of tellurium, tungsten, molybdenum, vanadium, nickel, antimony, magnesium, zirconium, silver, cobalt, cerium, and zinc, or oxides thereof. Preferably, the adhesion enhancer is tellurium or tellurium dioxide, and may be present in an amount of about 0.01-5 wt. % (based upon 100% total weight of the paste). The glass frits can be leaded or lead-free and may be present in an amount of about 1-10 wt. %. The metallic particles can be any of silver, aluminum, gold or nickel, or any alloys thereof, and can be present in an amount of about 40-75 wt. %. Another aspect of the present invention relates to a solar cell printed with an electroconductive paste composition on its backside, as well as an assembled solar cell module. Another aspect of the present invention relates to soldering pads formed by the present invention electroconductive paste composition on a silicon substrate, wherein the pull force required to remove the soldering pad from the silicon substrate is above 1 Newton. An additional aspect of the present invention relates to a method of producing a solar cell.