Silicon wafer pre-alignment device

Abstract

The present invention discloses a silicon wafer pre-alignment apparatus, which comprises a rotation table, a data acquisition module, a centering table and an adjustment module, wherein the rotation table is provided for bearing a silicon wafer and is provided with a rotation center, the data acquisition module is provided for collecting edge data and notch data of the silicon wafer, and calculating an offset of the silicon wafer center and the rotation center, and a notch vertex position, the centering table can absorb the silicon wafer, and the adjustment module is connected to the data acquisition module and the centering table so as to drive the centering table to move, and comprises a X direction adjustment unit, a Z direction adjustment unit and a Rz direction adjustment unit. According to the present invention, the centering table is driven by the Z direction adjustment unit to move along the Z direction so as to absorb a silicon wafer, the X direction adjustment unit and the Rz direction adjustment unit adjust the position of the silicon wafer according to an offset so as to make the silicon wafer center and the rotation center overlay, and then the rotation table rotates the silicon wafer to achieve a preset angle according to a vertex position so as to complete orientation of the notch. With the present invention, automatic centering of a silicon wafer and automatic orientation of a silicon wafer notch can be achieved.

Description

technical field [0001] The invention relates to the field of integrated circuit manufacturing, in particular to a silicon chip pre-alignment device. Background technique [0002] The photolithographic etching method is to image the circuit pattern drawn on the mask plate on the surface of the silicon wafer coated with photoresist and other photosensitive materials through the projection exposure device, and then through the etching process on the surface of the silicon wafer for manufacturing the integrated circuit. above to form a pattern. [0003] The projection exposure device projects the circuit pattern on the reticle through an optical system such as a projection exposure lens, and projects the circuit pattern at a certain magnification or reduction ratio on the surface of the silicon wafer for manufacturing integrated circuits. [0004] When using a projection exposure device for exposure, the position of the mask plate and the exposure object (such as silicon wafer,...

AI Technical Summary

Problems solved by technology

[0005] At present, there are many silicon wafer pre-alignment devices and pre-alignment methods used in projection exposure devices, but due to the complexity of the silicon wafer pre-alignment devices, there are still some problems in order to improve the pre-alignment accuracy and reduce the pre-alignment time. certain degree of difficulty

Improper silicon wafer pre-alignment device will complicate the alignment process of the exposure device, increase the alignment time, and ultimately affect the productivity of the equipment

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