Novel semiconductor packaging method

Abstract

The invention discloses a novel semiconductor packaging method. According to the method, a circle of inner ring metal cushions and a circle of outer ring metal cushions are manufactured on the same lateral side of a substrate, the inner ring metal cushions correspond to metal contacts on chips in position, the inner ring metal cushions are communicated with the outer ring metal cushions respectively in a paired mode in the substrate, metal lugs are manufactured on the metal contact of each chip and / or on each inner ring metal cushion respectively, the chips are welded on the substrate in an inversed mode, metal circuits and metal welding pads which are communicated with the outer ring metal cushions are manufactured on the back sides of the chips, input and output metal protruding points are manufactured on the metal welding pads, and then the packaging of the chips is achieved. According to the novel semiconductor packaging method, the metal lugs are directly manufactured on the metal contacts of the chips or on the inner ring metal cushions of the substrate, the chips are welded on the substrate in the inversed mode, a silicon layer below the metal contact of each chip is complete, supporting force is firmer, the rupture phenomenon is avoided, and thermal shock resistance and moisture shock resistance of products are better.

Description

technical field [0001] The invention relates to semiconductor packaging, in particular to a novel semiconductor packaging method. Background technique [0002] A critical step in the fabrication of integrated circuit devices is called "packaging," which involves mechanically manipulating the silicon die that is the heart of the integrated circuit and making the electrical interconnections between predetermined locations on the die and external electrical terminals. and environmental protection. [0003] Three main technologies are currently used to package semiconductors: wire bonding, tape automated attachment (TAB), and flip-chip. [0004] Wire bonding uses heat and ultrasonic energy to bond gold wire between pads on the silicon die and contacts on the package. [0005] Tape Automatic Fixation (TAB ) uses a copper foil tape instead of welding wire. The copper foil tape has different configurations depending on the specific die and package combination and inc...

AI Technical Summary

Problems solved by technology

Such interconnects suffer from homogeneity in solder bumps and in thermal expansion mismatch, which limits the available substrates to silicon or materials with similar thermal expansion characteristics to silicon

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