The invention discloses a novel
semiconductor packaging method. According to the method, a circle of inner ring
metal cushions and a circle of outer ring
metal cushions are manufactured on the same lateral side of a substrate, the inner ring
metal cushions correspond to metal contacts on chips in position, the inner ring metal cushions are communicated with the outer ring metal cushions respectively in a paired mode in the substrate, metal lugs are manufactured on the metal contact of each
chip and / or on each inner ring metal
cushion respectively, the chips are welded on the substrate in an inversed mode, metal circuits and metal
welding pads which are communicated with the outer ring metal cushions are manufactured on the back sides of the chips, input and output metal protruding points are manufactured on the metal
welding pads, and then the packaging of the chips is achieved. According to the novel
semiconductor packaging method, the metal lugs are directly manufactured on the metal contacts of the chips or on the inner ring metal cushions of the substrate, the chips are welded on the substrate in the inversed mode, a
silicon layer below the metal contact of each
chip is complete, supporting force is firmer, the rupture phenomenon is avoided, and
thermal shock resistance and
moisture shock resistance of products are better.