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Method for positioning and homogenizing residual stress of thermal shock compounding

A residual stress and thermal vibration technology, applied in special data processing applications, instruments, electrical and digital data processing, etc., can solve the problems of small processing deformation, lack of implementation applications, limited effect of vibration aging technology, etc., to increase molecular vitality, The effect of simulation and experiment is consistent, saving the time of testing and comparison

Active Publication Date: 2014-01-01
BEIHANG UNIV
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Problems solved by technology

[0011] The purpose of the present invention is to provide a method for positioning and homogenizing thermal vibration composite residual stress to solve the problems of limited effect of existing vibration aging technology and lack of scientific basis for implementation and application, so as to obtain small processing deformation, stable service size and high fatigue lifetime workpiece

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  • Method for positioning and homogenizing residual stress of thermal shock compounding
  • Method for positioning and homogenizing residual stress of thermal shock compounding

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Embodiment Construction

[0042] Combined with the accompanying drawings figure 2 Describe the specific steps of the thermal shock composite residual stress localization and homogenization method described in the present invention:

[0043] Step 1: Carry out continuous slicing for a specific workpiece or its blank, such as figure 1 As shown, after preparing the sample, the digital image of each section of the material is obtained by means of a transmission electron microscope, which is converted into a three-dimensional model by segmentation processing, and then the geometric model is established in the finite element software to obtain a mesoscopic geometric model based on the microstructure;

[0044] Step 2: While continuously slicing in step 1, detect the residual stress of each layer through X-ray diffraction equipment, and obtain the three-dimensional residual stress field of the workpiece;

[0045] Step 3: Mesh the geometric model of step 1, then match it with the residual stress field measured...

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Abstract

The invention provides a method for positioning and homogenizing residual stress of thermal shock compounding. The method comprises the following steps: (1) establishing a microscomic geometric model based on a microstructure of a workpiece material; (2) detecting a three-dimensional residual stress field of a workpiece; (3) matching the step (1) according to the step (2) to obtain a microscomic mechanical model; (4) carrying out a thermal aging analysis on the workpiece and establishing a temperature field and residual stress homogenizing relation; (5) carrying out a vibration aging analysis on the workpiece and selecting a suitable vibration mode; (6) determining a reasonable excitation force according to a residual stress relaxation condition and a dislocation changing principle; (7) carrying out simulation on thermal-vibration compounding aging and optimizing technological parameters including thermal aging temperatures, the excitation force, excitation frequencies, excitation positions, supporting positions, working time and the like; and (8) carrying out residual stress homogenization on the workpiece by using the step (7). According to the method provided by the invention, positioning relaxation and comprehensive homogenization of the residual stress of the workpiece are realized so as to obtain the workpiece with small machining deformation, stable service size and long fatigue life.

Description

technical field [0001] The invention relates to a method for positioning and homogenizing thermal shock composite residual stress, which is a method for eliminating residual stress by utilizing the composite effect of heat and vibration, and is used to realize relaxation and positioning homogenization of workpiece residual stress. The invention belongs to the fields of non-traditional processing technology and sustainable manufacturing in mechanical manufacturing. Background technique [0002] With the steady development of the national economy and the needs of scientific and technological progress, the advanced manufacturing field represented by aerospace has higher and higher requirements for product performance. However, the large overall thin-walled structural parts used in aircraft often have excessive processing deformation during machining, which directly leads to adverse consequences such as workpiece scrapping and construction delays; , will also produce large serv...

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Application Information

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IPC IPC(8): G06F17/50
Inventor 张以都吕田吴琼
Owner BEIHANG UNIV
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