Organic light emitting diode packaging method and system
A light-emitting diode and packaging system technology, which is applied in the organic light-emitting diode packaging system and the field of organic light-emitting diode packaging, can solve the problems of excessive thermal stress on the glass substrate, and achieve the effects of prolonging the cooling time, preventing cracking, and reducing thermal stress
Active Publication Date: 2017-04-26
SHANGHAI UNIV
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[0004] Based on this, it is necessary to address the problem of excessive thermal stress on the glass substrate and provide an organic light emitting diode packaging method that reduces the thermal stress on the glass substrate during the packaging process of the organic light emitting diode.
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[0030] An organic light-emitting diode packaging method and packaging system. After heating and bonding the organic light-emitting diode, the bonding part is heated and cooled, that is, the temperature of the bonding part is reduced by smoothly reducing the heating temperature until the bonding part is reduced Room temperature. The temperature of the bonding part is cooled by a smooth cooling method, so that the temperature of the bonding part after heating and bonding is gradually reduced to normal temperature, which prolongs the cooling time of the bonding part, reduces the thermal stress on the bonding part, and prevents bonding. The bonding part caused problems such as cracking due to the sudden drop in temperature, which improved the yield of organic light-emitting diode devices.
[0031] Hereinafter, an organic light emitting diode packaging method and an organic light emitting diode packaging system will be further described in detail with reference to the accompanying dra...
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The invention discloses a method for encapsulating an organic light-emitting diode. After the organic light-emitting diode is heated and bonded, the bonding site is heated and cooled, that is, the temperature of the bonded site is lowered in a manner of smoothly reducing the heating temperature until the bonded site is closed. The temperature dropped to normal temperature. The temperature of the bonded part is lowered by smooth cooling, so that the temperature of the bonded part is gradually reduced to normal temperature after heating and bonding, which reduces the thermal stress on the bonded part and prevents the bonded part from cracking due to a sudden drop in temperature Problems such as this improve the yield rate of organic light emitting diode device products. At the same time, the invention also discloses an organic light emitting diode packaging system.
Description
Technical field [0001] The present invention relates to the technical field of light emitting diode packaging, in particular to an organic light emitting diode packaging method and an organic light emitting diode packaging system. Background technique [0002] Organic Light-Emitting Diode (OLED), also known as Organic Electro luminesence Display (OELD). Organic light-emitting diodes have the characteristics of self-luminescence, using very thin organic material coatings and glass substrates, when current passes through, organic materials will emit light. [0003] In the encapsulation process of the organic light emitting diode device, the encapsulation is completed after bonding, resulting in excessive thermal stress on the encapsulated glass substrate under the influence of the ambient temperature, and easy cracking, which greatly affects the yield of the product. Summary of the invention [0004] Based on this, it is necessary to address the problem of excessive thermal stress on...
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IPC IPC(8): H01L51/50H05B33/04H01L51/56
CPCH10K50/841
Inventor 张建华段玮葛军锋
Owner SHANGHAI UNIV