Uncovering method of rigid-flex combination board

Abstract

The invention discloses an uncovering method of a rigid-flex combination board. The method comprises the first step that operation from blanking of the rigid-flex combination board to the surface processing procedure is finished through normal printed wiring board making operation; the second step that when an internal layer circuit of the rigid-flex combination board is manufactured, a protective copper line is reserved at the uncovering position, the length of the copper line is slightly larger than the uncovering length, and the width of the copper line is 5-15mil; the third step that the operation of laser uncovering and belt drilling is finished; the fourth step that the part, between a solder mask layer and a copper protective layer, of a hardboard is burnt out; the fifth step that the rigid-flex combination board is manufactured to be of a design shape through a forming procedure, hard board layers which do not need to be reserved in design paper are removed through an uncovering tool, and then the uncovering operation is finished. According to the rigid-flex combination board obtained through the uncovering method of the rigid-flex combination board, machining on the double faces is achieved, patterns transfer easily, the reliability is high, a soft board layer can be effectively prevented from being burnt by laser, flexibility is good, bending radius is large and bending times are increased.

Description

technical field [0001] The invention relates to a rigid-flex board, in particular to a method for uncovering a rigid-flex board. Background technique [0002] The existing rigid-flex board uncapping operation requires double-sided processing, which greatly wastes production capacity, and the thickness and shape of the processing are relatively limited, and the processing of thin plates and complex uncapping patterns cannot be realized. However, in the existing single-sided processing methods, the potion penetrates into the bonding position of the soft board and the hard board, resulting in abnormal reliability failure; and there are obvious pits at the uncovering position, which increases the difficulty of pattern transfer and cannot meet the production requirements of fine lines. . Contents of the invention [0003] The purpose of the present invention is to provide a rigid-flexible substrate that can realize double-sided processing, easy pattern transfer, high reliabili...

AI Technical Summary

Problems solved by technology

[0002] The existing rigid-flex board uncapping operation requires double-sided processing, which greatly wastes production capacity, and the thickness and shape of the processing have relatively large restrictions, which cannot realize the processing of thin plates and complex uncapping patterns.

However, in the existing single-sided processing methods, the potion penetrates into the bonding position of the soft board and the hard board, resulting in abnormal reliability failure; and there are obvious pits at the uncovering position, which increases the difficulty of pattern transfer and cannot meet the production requirements of fine lines.

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