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Laser processing device and laser processing method

A technology of laser processing and processed objects, applied in metal processing, laser welding equipment, metal processing equipment, etc., can solve the problems of difficult precision processing, impossible precision processing, etc., and achieve the effect of high plane precision and high precision

Active Publication Date: 2014-01-01
PANASONIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The laser processing device of the second example is more difficult to perform precise processing than the prior art of the first example, and it can be said that it is impossible to perform precise processing on a large workpiece.

Method used

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  • Laser processing device and laser processing method
  • Laser processing device and laser processing method
  • Laser processing device and laser processing method

Examples

Experimental program
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Effect test

Embodiment approach

[0057] figure 1 It is a perspective view which shows the schematic structure of the laser processing apparatus 100 which concerns on an example of embodiment of this invention. exist figure 1 In , in order to facilitate visual confirmation of the structure of the device, the workpiece and the jig sheet described later are removed. In addition, in order to explain the detailed structure, figure 2 It is a cross-sectional view of the laser processing apparatus 100 viewed from the X direction.

[0058] exist figure 1 and figure 2 In this case, a laser beam 103 is emitted from a laser oscillator 102 and guided to an optical system 104 including mirrors and lenses. The optical system 104 adjusts the density (laser diameter) of the laser beam 103 , shapes the shape, suppresses stray light, and the like so that the laser beam 103 is directed in a predetermined direction.

[0059] The laser beam 103 after passing through the optical system 104 is directed to a galvano scanne...

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Abstract

In order to prevent deterioration of the flatness of a sheet-form workpiece, this laser processing device is provided with a work table, an outer periphery mounting unit (114), a first movable mounting unit (112), a second movable mounting unit (113), a workpiece restraining unit (121), a processing head unit (109), and a movable dust collection unit (123). The first movable mounting unit (112) and second movable mounting unit (113) are provided on the work table and inside of the outer periphery mounting unit (114), and can move vertically. The workpiece restraining unit (121) is provided on the outer periphery mounting unit (114), and the processing head unit (109) is provided above the first movable mounting unit (112) or the second movable mounting unit (113). The movable dust collection unit (123) is provided inside of the outer periphery mounting unit (114) and can move horizontally. This laser processing method involves a first laser processing step, a first step for lowering the second movable mounting unit, a first step for moving the dust collection unit, a first step for raising the first movable mounting unit, and a second laser processing step.

Description

technical field [0001] The present invention relates to a laser processing device for processing by irradiating laser light, and more particularly to a laser processing device and a laser processing method for performing through-hole processing (through-hole processing). Background technique [0002] In recent years, with the miniaturization, high integration, and composite modularization of parts, the diameter of the punching process of the base material that forms the basis of them has also been reduced, which is difficult to achieve with the existing processing methods. In order to solve the above-mentioned problems, drilling processing using a laser is gradually increasing. This laser-based hole processing of a workpiece is roughly classified into two types: through-hole processing in which a through hole is formed in the workpiece; and blind hole processing in which a non-through hole is formed in the workpiece. [0003] Figure 26 It is a sectional view showing the st...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/382B23K26/142B23K26/08B23K26/70
CPCB23K26/1405B23K26/10H05K3/00B23K26/0876B23K26/16B23K26/14B23K26/08B23K26/142H05K3/0038H05K3/26H05K2203/081H05K2203/082B23K26/702B23K26/382B23K2101/36
Inventor 西原学平本匡宽樱井通雄迫田义照舩井皓平
Owner PANASONIC CORP
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