High-yield cultivation method for increasing grains per spike and grain weight of winter wheat and making winter wheat ripen in advance
A technology of early maturation and cultivation methods, applied in the field of balanced yield increase, can solve the problems of increasing the number of grains per panicle and grain weight, increasing the yield per unit area, etc., and achieve the increase of the number of grains per panicle, the improvement of the seed setting rate, and the reduction of the degeneration number and degradation rate of florets Effect
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Examples
example 1
[0016] Example one: The winter wheat variety Shimai 18 was selected. On December 1st, a 1m-long bamboo split was used to build a multi-story arched scaffold with a height of 20cm and a total width of 5m. On January 20th, a plastic film with a thickness of 0.06mm, 0.03mm and 0.03mm from top to bottom and a width of 6 meters was covered on the arch shed. There was a hole with a diameter of 20mm on the innermost plastic film, accounting for about 40% of the total area. . The plastic film around the shed is compacted on the ground with soil. On February 15th, the outermost plastic film with a thickness of 0.06mm was peeled off, and on March 5th, the second layer of plastic film with a thickness of 0.03mm was peeled off. The east and west sides of the three-layer perforated membrane are ventilated. On March 31, the third layer of porous film was removed, and the scaffolding was dismantled at the same time.
[0017] Field management work such as sowing, irrigation, weeding, cont...
example 2
[0018] Example two: The winter wheat variety Hengguan 35 was selected. On December 1, bamboo splits with a length of 1.5m were used to build an arched scaffolding with a height of 25cm and a total width of 7m. On January 25th, a plastic film with a thickness of 0.08mm, 0.03mm and 0.03mm from top to bottom and a width of 8 meters was covered on the arch shed. The innermost plastic film had a hole with a diameter of 15mm, accounting for about 35% of the total area. . The plastic film around the shed is compacted on the ground with soil. On February 20, the outermost layer of plastic film with a thickness of 0.08mm was removed. On March 8, the second layer of plastic film with a thickness of 0.03mm was removed. The east and west sides of the three-layer perforated membrane are ventilated. On April 3, the third layer of porous film was removed, and the scaffolding was dismantled at the same time.
[0019] Field management work such as sowing, irrigation, weeding, control of d...
example 3
[0020] Example three: The winter wheat variety Heng 4399 was selected. On December 1, bamboo splits with a length of 1.8m were used to build an arched scaffolding with a height of 20cm and a total width of 5m. On January 30th, a plastic film with a thickness of 0.08mm, 0.03mm and 0.03mm from top to bottom and a width of 6 meters was covered on the arch shed. There was a hole with a diameter of 20mm on the innermost plastic film, accounting for about 40% of the total area. . The plastic film around the shed is firmly on the ground with bricks. On February 18, the outermost layer of plastic film with a thickness of 0.08mm was removed, and on March 10, the second layer of plastic film was removed. The east and west sides of the three-layer perforated membrane are ventilated. Remove the third layer of perforated film on April 1, and dismantle the scaffolding at the same time.
[0021] Field management work such as sowing, irrigation, weeding, control of diseases and insect pe...
PUM
Property | Measurement | Unit |
---|---|---|
Height | aaaaa | aaaaa |
Diameter | aaaaa | aaaaa |
Thickness | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com