This helps you quickly interpret patents by identifying the three key elements:
Problems solved by technology
Method used
Benefits of technology
Problems solved by technology
However, in wiring boards used in the high-frequency region of 20 GHz or higher, if a slight deviation in characteristic impedance or internal skew occurs, the influence on the entire transmission path will increase, so it is expected to solve this problem
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more
Image
Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
Click on the blue label to locate the original text in one second.
Reading with bidirectional positioning of images and text.
Smart Image
Examples
Experimental program
Comparison scheme
Effect test
no. 1 approach ）
[0048] Figure 1A and 1B is a diagram showing a configuration example of the wiring board 1 according to the first embodiment of the present invention, Figure 1A is a top view, Figure 1B is a sectional view.
[0049] Wiring board 1A ( 1 ) according to the present embodiment includes, on one surface 10 a of board 10 , differential transmission line 13 constituted by two wiring lines 12A and 12B arranged in parallel.
[0050] In addition, wiring board 1A ( 1 ) has insulating resin layer 11 (insulating layer) formed on part of one surface 10 a of substrate 10 . On the boundary between one surface 10 a of the substrate 10 and the upper surface 11 a of the insulating resin layer 11 , a step portion 20 composed of the side surface 11 b of the insulating resin layer 11 is formed. The two wirings 12A and 12B constituting the differential transmission path 13 are arranged to extend from the one surface 10 a of the substrate 10 to the upper surface 11 a of the insulating resin laye...
no. 2 approach ）
[0073] Hereinafter, the wiring board 1 according to the second embodiment of the present invention will be described.
[0074] In the following description, configurations different from those of the first embodiment described above will be mainly described, and descriptions of configurations similar to those of the first embodiment will be omitted.
[0075] Figure 4A and 4B is a diagram showing an example of the configuration of the wiring board according to the present embodiment, in particular, a perspective view in which a part of the differential transmission path is enlarged.
[0076] In the above-mentioned first embodiment, as Figure 4A As shown, the side surface 11b of the insulating resin layer 11 constituting the step portion 20 is approximately perpendicular to the one surface 10a of the substrate 10 .
[0077] On the other hand, in the wiring board 1D ( 1 ) according to this embodiment (second embodiment), as Figure 4B As shown, the side surface 11b of the in...
no. 3 approach ）
[0080] Hereinafter, a wiring board 1 according to a third embodiment of the present invention will be described.
[0081] In the following description, configurations different from those of the first embodiment described above will be mainly described, and descriptions of configurations similar to those of the first embodiment will be omitted.
[0082] Figure 5 ~ Figure 8 It is a diagram showing a configuration example of a wiring board according to the present embodiment, and in particular, a perspective view showing an enlarged portion of a differential transmission path.
[0083] exist Figure 5 In the illustrated wiring board 1E ( 1 ), the two wirings 12A and 12B have the same width at each position equidistant from the edge ( 11 b ), and the above two wirings 12A and 12B on the upper surface 11 a of the insulating resin layer 11 . The width of the strip wiring 12A, 12B changes.
[0084] In the wiring board 1E ( 1 ) according to this embodiment, since the widths of th...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More
PUM
Login to View More
Abstract
This wiring board is provided with: a substrate; a differential transmission path configured of two wiring lines disposed parallel to each other on one surface of the substrate; and an insulating resin layer formed on a part of the one surface of the substrate. A step section configured of the side surface of the insulating resin layer is formed at the boundary between the one surface of the substrate and the upper surface of the insulating resin layer, and the two wiring lines are extended to traverse the step section from the one surface of the substrate to the upper surface of the insulating resin layer. In a planar view of the substrate, the direction in which the two wiring lines that traverse the step section are extended, and the direction of a side end, which is defined by the boundary between the upper surface of the insulating resin layer and the side surface of the insulating resin layer constituting the step section, are orthogonal to each other.
Description
technical field [0001] The present invention relates to a wiring board, and more specifically, to a wiring board having a differential transmission path for transmitting a differential signal. [0002] this application claims priority based on Japanese Patent Application No. 2012-073735 for which it applied in Japan on March 28, 2012, and uses the content here. Background technique [0003] With the development of electronic information equipment, wiring boards used in electronic equipment are required to increase the speed of signals. As a method of transmitting signals at high speed, a differential transmission method is adopted. In differential transmission, a pair of lines transmits a high-frequency signal of opposite polarity (for example, a high-frequency band above 20 GHz), and the signal is identified based on the potential difference between the lines. Therefore, the differential transmission method has the characteristic of resisting common mode noise. Examples ...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More
Application Information
Patent Timeline
Application Date:The date an application was filed.
Publication Date:The date a patent or application was officially published.
First Publication Date:The earliest publication date of a patent with the same application number.
Issue Date:Publication date of the patent grant document.
PCT Entry Date:The Entry date of PCT National Phase.
Estimated Expiry Date:The statutory expiry date of a patent right according to the Patent Law, and it is the longest term of protection that the patent right can achieve without the termination of the patent right due to other reasons(Term extension factor has been taken into account ).
Invalid Date:Actual expiry date is based on effective date or publication date of legal transaction data of invalid patent.
Login to View More 
Login to View More