CMP wafer carrier

Abstract

Provided is a chemical mechanical polishing wafer loader. An upper spherical bearing, a lower spherical bearing, an upper cross coupling, a lower cross coupling, a supporting pillar fixed on a flow collecting disc, an installation ring in sliding connection with the supporting pillar and a guide hole positioned in an upper cover are adopted to form a universal joint structure, and a wafer is driven to automatically perform universal deflection; an outer supporting screw positioned on a clamping ring, a limiting hole positioned on a retaining ring and forming a matching pair with the outer supporting screw and an air bag form a retaining ring movement limiting mechanism, so that the service life of the retaining ring is prolonged, and the retaining ring is reasonable in replacement cycle and easy to replace; the retaining ring, the clamping ring and an adjusting gasket form a depth fine-adjustment mechanism of a wafer storage plane groove, and the adjusting gasket is replaced to keep the depth of a wafer installing groove within the specialized range. The upper cover and the flow collecting disc are of process hole structures while the edge effect is improved, so that back pressure fluid in zone control for wafers is distributed in a balanced mode, the action area is large, and pipes are convenient to install. The chemical mechanical polishing wafer loader is large in structural design size and can meet the large-diameter wafer polishing requirements.

Description

technical field [0001] The present invention relates to a polishing device, in particular to a chemical mechanical polishing wafer carrier. Background technique [0002] Chemical Mechanical Polishing (CMP) is a technique of polishing semiconductor materials or other materials by chemical solution etching combined with mechanical particle grinding. It is widely used in integrated circuit (IC) manufacturing. Wafers (or chips) with high-precision, ultra-smooth, damage-free surfaces are obtained by chemical mechanical polishing equipment. Chemical mechanical polishing equipment mainly includes polishing spindle, wafer carrier, polishing table, polishing pad, and polishing liquid pipeline. The wafer carrier is the heart of the device. The wafer carrier is fixed on the underside of the polishing spindle, the polishing pad is attached to the polishing table, and the wafer to be polished is located between the wafer carrier and the polishing pad. The polishing spindle is connecte...

AI Technical Summary

Problems solved by technology

The structure of the connection between the two parts of the existing wafer carrier is basically an airbag type, which has many disadvantages

[0004] 2) At present, the diameter of the wafer is becoming larger and larger. Due to the inconsistent rotational speed of the wafer carrier, if only a single back pressure is applied to the wafer, the polishing removal rate of different regions will be different, resulting in the wafer polishing surface shape. awkward

In order to avoid the above problems, using different back pressures for different polishing areas is the basic technology to avoid the abrupt wafer surface shape, but the current fluid pipeline structure design for regional control of wafer back pressure is complicated and difficult to install

[0005] 3) "Edge effect" will cause a certain area at the edge of the wafer to be difficult to achieve sub-micron precision, reducing wafer yield and chip output

The replacement of the traditional retaining ring is carried out by working for a certain period of time or polishing a certain amount of wafers. In order to prevent the occurrence of "edge effect", the retaining ring is often replaced in advance and frequently, resulting in a short service life

PEEK / PPS materials are expensive, premature replacement will cause waste, frequent replacement will affect the normal operation of the equipment, reduce production capacity and efficiency

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